Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | TP53 | P04637 | 1/20 | 0.33 |
| ▸ | BBOX1 | O75936 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Potassium Ion SCHEMBL28676428 | 0.94 | — | — | |
| SCHEMBL1138619 | 0.94 | TSHR (0.33) | TSHRTDP1TP53BBOX1ALDH1A1 | |
| SCHEMBL490865 | 0.94 | — | — | |
| SCHEMBL1138618 | 0.94 | TSHR (0.33) | TSHRTDP1TP53BBOX1ALDH1A1 | |
| SCHEMBL1138590 | 0.94 | TSHR (0.33) | TSHRTDP1TP53BBOX1ALDH1A1 | |
| SCHEMBL8008571 | 0.94 | TSHR (0.33) | TSHRTDP1TP53BBOX1ALDH1A1 | |
| SCHEMBL1863170 | 0.94 | TSHR (0.33) | TSHRTDP1TP53BBOX1ALDH1A1 | |
| Lithium Ion SCHEMBL4299560 | 0.94 | — | — | |
| SCHEMBL19809588 | 0.94 | TSHR (0.33) | TSHRTDP1TP53BBOX1ALDH1A1 | |
| SCHEMBL29878267 | 0.94 | TSHR (0.35) | TSHRTDP1TP53BBOX1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11993862-B2 | Structure including copper plating layer or copper alloy plating layer | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-05-28 | — | — | US | disclosed |
| US-11946153-B2 | Copper or copper alloy electroplating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-04-02 | — | — | US | disclosed |
| US-11939691-B2 | Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-03-26 | — | — | US | disclosed |
| US-20220316085-A1 | STRUCTURE INCLUDING COPPER PLATING LAYER OR COPPER ALLOY PLATING LAYER | ISHIHARA CHEMICAL CO., LTD. (JP) | 2022-10-06 | — | — | US | disclosed |
| US-20220127741-A1 | COPPER OR COPPER ALLOY ELECTROPLATING BATH | ISHIHARA CHEMICAL CO., LTD. (JP) | 2022-04-28 | — | — | US | disclosed |
| EP-0770708-B1 | Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use | DAIWA FINE CHEMICALS CO LTD (JP) | 2000-01-19 | — | — | EP | disclosed |
| EP-0770708-A1 | Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use | Daiwa Fine Chemicals Co., Ltd. (JP) | 1997-05-02 | — | — | EP | disclosed |
| US-5618404-A | APPLYING DIRECT CURRENT VOLTAGE TO AN ANODE MADE OF LEAD OR TIN IN AN ELECTROLYTE SOLUTION CONTAINING AN ORGANIC SULFONIC ACIDS; IONIZATION | DAIWA FINE CHEMICALS CO., LTD. (JP) | 1997-04-08 | — | — | US | disclosed |
| EP-0520421-B1 | Immersion tin/lead alloy plating bath | LEARONAL JAPAN INC (JP) | 1996-09-18 | — | — | EP | disclosed |
| EP-0520421-A2 | Immersion tin/lead alloy plating bath | LEARONAL JAPAN Inc. (JP) | 1992-12-30 | — | — | EP | disclosed |