Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTT | P42858 | 2/20 | 0.60 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.60 |
| ▸ | AR | P10275 | 1/20 | 0.58 |
| ▸ | MAPT | P10636 | 4/20 | 0.57 |
| ▸ | GAA | P10253 | 2/20 | 0.57 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.55 |
| ▸ | MEN1 | O00255 | 2/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.50 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.48 |
| ▸ | POLB | P06746 | 1/20 | 0.48 |
| ▸ | CASR | P41180 | 2/20 | 0.47 |
| ▸ | HPGD | P15428 | 1/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.46 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.45 |
| ▸ | TSHR | P16473 | 1/20 | 0.45 |
| ▸ | LMNA | P02545 | 1/20 | 0.45 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11964790 | 0.94 | HTT (0.67) | HTTHIF1AARMAPTGAA | |
| SCHEMBL12789564 | 0.92 | HTT (0.65) | HTTHIF1AARMAPTGAA | |
| SCHEMBL1708894 | 0.92 | HTT (0.65) | HTTHIF1AARMAPTGAA | |
| SCHEMBL12267193 | 0.89 | HTT (0.58) | HTTHIF1AARMAPTGAA | |
| SCHEMBL1496665 | 0.88 | POLB (0.57) | HTTMAPTGAAKMT2AMEN1 | |
| SCHEMBL9889752 | 0.88 | HSD11B1 (0.52) | HTTHIF1AARMAPTGAA | |
| SCHEMBL14595232 | 0.88 | HTT (0.61) | HTTHIF1AARMAPTGAA | |
| SCHEMBL24046837 | 0.88 | HTT (0.60) | HTTHIF1AARMAPTGAA | |
| SCHEMBL20851321 | 0.88 | HTT (0.60) | HTTHIF1AARMAPTGAA | |
| SCHEMBL19482753 | 0.88 | AR (0.76) | HTTHIF1AARMAPTGAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 124 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11078324-B2 | Seal material composition, liquid crystal cell, and scanned antenna | SHARP KABUSHIKI KAISHA (JP) | 2021-08-03 | — | — | US | disclosed |
| US-20190292307-A1 | SEAL MATERIAL COMPOSITION, LIQUID CRYSTAL CELL, AND SCANNED ANTENNA | SHARP KABUSHIKI KAISHA (JP) | 2019-09-26 | — | — | US | disclosed |
| US-20180174882-A1 | THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED LASER WAFER DE-BONDING | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2018-06-21 | — | — | US | disclosed |
| US-9947567-B2 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2018-04-17 | — | — | US | disclosed |
| US-20170320052-A1 | COMPOSITIONS AND METHODS FOR REDUCING ATMOSPHERIC OZONE LEVELS | AIR CROSS INC (US) | 2017-11-09 | — | — | US | disclosed |
| US-20170313834-A1 | METHACRYLATE RESIN COMPOSITION AND MOLDED ARTICLE | KURARAY CO., LTD. (JP) | 2017-11-02 | — | — | US | disclosed |
| US-9803081-B2 | Reinforced thermoplastic resin composition and molded article | UMG ABS, LTD. (JP) | 2017-10-31 | — | — | US | disclosed |
| US-9803083-B2 | Reinforced thermoplastic resin composition and molding | UMG ABS, LTD. (JP) | 2017-10-31 | — | — | US | disclosed |
| US-9748131-B2 | Low temperature adhesive resins for wafer bonding | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2017-08-29 | — | — | US | disclosed |
| US-9732221-B2 | Reinforced thermoplastic resin composition and molded article | UMG ABS, LTD. (JP) | 2017-08-15 | — | — | US | disclosed |
| US-20080131639-A1 | Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same | TORAY INDUSTRIES, INC. (JP) | 2008-06-05 | — | — | US | disclosed |
| US-20080064233-A1 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2008-03-13 | — | — | US | disclosed |
| US-20080054225-A1 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2008-03-06 | — | — | US | disclosed |
| US-20080057742-A1 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2008-03-06 | — | — | US | disclosed |
| US-20070299172-A1 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2007-12-27 | — | — | US | disclosed |
| US-7309560-B2 | Composition for forming anti-reflective coating | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2007-12-18 | — | — | US | disclosed |
| US-20070190459-A1 | Resist underlayer coating forming composition for mask blank, mask blank and mask | HOYA CORPORATION (JP) | 2007-08-16 | — | — | US | disclosed |
| US-20070142538-A1 | Resin composition for sliding member, and sliding member | OILES CORPORATION (JP) | 2007-06-21 | — | — | US | disclosed |
| US-20070104973-A1 | Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same | SONY CHEMICALS CORPORATION (JP) | 2007-05-10 | — | — | US | disclosed |
| US-20070020307-A1 | Medical devices containing radiation resistant polymers | BOSTON SCIENTIFIC SCIMED, INC. | 2007-01-25 | — | — | US | disclosed |