SCHEMBL801638

SCHEMBL801638

CCC(C)(C)C(=O)OCCC(=O)OC

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.44
RECQL P46063 1/20 0.38
KMT2A Q03164 2/20 0.35
TET2 Q6N021 1/20 0.35
MEN1 O00255 1/20 0.35
LMNA P02545 3/20 0.34
CA12 O43570 3/20 0.34
CA14 Q9ULX7 3/20 0.34
KDM4E B2RXH2 1/20 0.34
ALDH1A1 P00352 3/20 0.33
HSD17B10 Q99714 2/20 0.33
CYP4F2 P78329 1/20 0.33
CYP4A11 Q02928 1/20 0.33
MAPT P10636 1/20 0.33
HTT P42858 1/20 0.33
MGAM O43451 2/20 0.32
GAA P10253 2/20 0.32
SI P14410 2/20 0.32
MGAM2 Q2M2H8 2/20 0.32
CA2 P00918 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16866392 0.89 TSHR (0.46) TSHRRECQLKMT2ATET2MEN1
SCHEMBL19821844 0.89 TSHR (0.48) TSHRRECQLKMT2ATET2MEN1
SCHEMBL11964192 0.86 TSHR (0.45) TSHRRECQLKMT2ALMNAALDH1A1
SCHEMBL2607618 0.85 CYP1A2 (0.42) TSHRLMNAALDH1A1CYP4F2CYP4A11
SCHEMBL18100050 0.83 CYP4F2 (0.33) CA12CA14ALDH1A1CYP4F2CYP4A11
SCHEMBL14727468 0.83 MGAM (0.40) TSHRRECQLTET2CA12CA14
SCHEMBL12920504 0.82 TSHR (0.50) TSHRRECQLKMT2ATET2MEN1
SCHEMBL14727465 0.81 RECQL (0.37) TSHRRECQLTET2LMNAKDM4E
SCHEMBL824523 0.81 CYP4F2 (0.41) TSHRALDH1A1CYP4F2CYP4A11GAA
SCHEMBL17860820 0.80 DGKA (0.47) TSHRRECQLLMNAALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11773266-B2 Polymer, molded body, foam, resin composition, and production method for polymer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-10-03 US disclosed
US-20230129965-A1 HYDROPHILIC AND OLEOPHOBIC POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-04-27 US disclosed
US-20180030175-A1 POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-02-01 US disclosed
US-9540468-B2 Resist copolymer and resist composition MITSUBISHI RAYON CO., LTD. (JP) 2017-01-10 US disclosed
US-9389507-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2016-07-12 US disclosed
US-20140371412-A1 RESIST COPOLYMER AND RESIST COMPOSITION MITSUBISHI RAYON CO., LTD. (JP) 2014-12-18 US disclosed
US-20140255846-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2014-09-11 US disclosed
US-8766388-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2014-07-01 US disclosed
US-8759741-B2 Titanium black dispersion, photosensitive resin composition, wafer level lens, light blocking film, method for producing the light blocking film, and solid-state image pickup element FUJIFILM CORPORATION (JP) 2014-06-24 US disclosed
US-20120199727-A1 TITANIUM BLACK DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, WAFER LEVEL LENS, LIGHT BLOCKING FILM, METHOD FOR PRODUCING THE LIGHT BLOCKING FILM, AND SOLID-STATE IMAGE PICKUP ELEMENT FUJIFILM CORPORATION (JP) 2012-08-09 US disclosed
US-20120082935-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM FORMED USING THE SAME JSR CORPORATION (JP) 2012-04-05 US disclosed
US-20120068292-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2012-03-22 US disclosed