SCHEMBL801659

SCHEMBL801659

CCC(C)(C)C(=O)OCC[Si](C)(C)OC

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CYP4F2 P78329 1/20 0.32
CYP4A11 Q02928 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15356149 0.90 CYP4F2 (0.33) CYP4F2CYP4A11
SCHEMBL12626349 0.86 CYP4F2 (0.32) CYP4F2CYP4A11
SCHEMBL17717761 0.84 CYP4F2 (0.31) CYP4F2CYP4A11
SCHEMBL12014817 0.84 CYP4F2 (0.33) CYP4F2CYP4A11
SCHEMBL802213 0.84 CYP4F2 (0.33) CYP4F2CYP4A11
SCHEMBL107821 0.83 CYP4F2 (0.34) CYP4F2CYP4A11
SCHEMBL18014640 0.81 CYP4F2 (0.33) CYP4F2CYP4A11
SCHEMBL16330007 0.81
SCHEMBL14369889 0.80 CYP4F2 (0.33) CYP4F2CYP4A11
SCHEMBL12130508 0.79 CYP4F2 (0.33) CYP4F2CYP4A11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9818778-B2 Solid-state image sensor and its manufacturing method, curable composition for forming infrared cut-off filters, and camera module FUJIFILM CORPORATION (JP) 2017-11-14 US disclosed
US-9389507-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2016-07-12 US disclosed
US-9354514-B2 Photosensitive transparent composition for color filter of solid-state imaging device, and production method of color filter of solid-state imaging device, color filter of solid-state imaging device, and solid-state imaging device, each using the same FUJIFILM CORPORATION (JP) 2016-05-31 US disclosed
US-20150372037-A1 SOLID-STATE IMAGE SENSOR AND ITS MANUFACTURING METHOD, CURABLE COMPOSITION FOR FORMING INFRARED CUT-OFF FILTERS, AND CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-12-24 US disclosed
US-9052458-B2 Radiation-sensitive colored composition, colored cured film, color filter and method of producing the same, solid-state imaging device, liquid crystal display apparatus, and method of producing dye FUJIFILM CORPORATION (JP) 2015-06-09 US disclosed
US-8908293-B2 Dispersion composition, photosensitive resin composition, and solid-state image pick-up element FUJIFILM CORPORATION (JP) 2014-12-09 US disclosed
US-20140255846-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2014-09-11 US disclosed
US-8790852-B2 Colored composition for light-shielding film, light-shielding pattern, method for forming the same, solid-state image sensing device, and method for producing the same FUJIFILM CORPORATION (JP) 2014-07-29 US disclosed
US-8766388-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2014-07-01 US disclosed
US-8759741-B2 Titanium black dispersion, photosensitive resin composition, wafer level lens, light blocking film, method for producing the light blocking film, and solid-state image pickup element FUJIFILM CORPORATION (JP) 2014-06-24 US disclosed
US-20130143164-A1 POLYMERIZABLE COMPOSITION FUJIFILM CORPORATION (JP) 2013-06-06 US disclosed
US-20130072615-A1 POLYMERIZABLE COMPOSITION FUJIFILM CORPORATION (JP) 2013-03-21 US disclosed
US-20120257283-A1 DISPERSION COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, AND SOLID-STATE IMAGE PICK-UP ELEMENT FUJIFILM CORPORATION (JP) 2012-10-11 US disclosed
US-8278386-B2 Dispersion composition, polymerizable composition, light-shielding color filter, solid-state image pick-up element, liquid crystal display device, wafer level lens, and image pick-up unit FUJIFILM CORPORATION (JP) 2012-10-02 US disclosed
US-20120235099-A1 RADIATION-SENSITIVE COLORED COMPOSITION, COLORED CURED FILM, COLOR FILTER AND METHOD OF PRODUCING THE SAME, SOLID-STATE IMAGING DEVICE, LIQUID CRYSTAL DISPLAY APPARATUS, AND METHOD OF PRODUCING DYE FUJIFILM CORPORATION (JP) 2012-09-20 US disclosed
US-20120199727-A1 TITANIUM BLACK DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, WAFER LEVEL LENS, LIGHT BLOCKING FILM, METHOD FOR PRODUCING THE LIGHT BLOCKING FILM, AND SOLID-STATE IMAGE PICKUP ELEMENT FUJIFILM CORPORATION (JP) 2012-08-09 US disclosed
US-20120104529-A1 COLORED COMPOSITION FOR LIGHT-SHIELDING FILM, LIGHT-SHIELDING PATTERN, METHOD FOR FORMING THE SAME, SOLID-STATE IMAGE SENSING DEVICE, AND METHOD FOR PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2012-05-03 US disclosed
US-20120068292-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2012-03-22 US disclosed
US-20110217637-A1 POLYMERIZABLE COMPOSITION FOR COLOR FILTER, COLOR FILTER, AND SOLID-STATE IMAGING DEVICE FUJIFILM CORPORATION (JP) 2011-09-08 US disclosed
US-20110124824-A1 DISPERSION COMPOSITION, POLYMERIZABLE COMPOSITION, LIGHT-SHIELDING COLOR FILTER, SOLID-STATE IMAGE PICK-UP ELEMENT, LIQUID CRYSTAL DISPLAY DEVICE, WAFER LEVEL LENS, AND IMAGE PICK-UP UNIT FUJIFILM CORPORATION (JP) 2011-05-26 US disclosed