SCHEMBL8019136

SCHEMBL8019136

CCCC=COCC1CO1

nearest known ligand 0.42

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.42
ALDH1A1 P00352 5/20 0.40
TDP1 Q9NUW8 1/20 0.40
TSHR P16473 2/20 0.35
MAPK1 P28482 1/20 0.35
ENPP2 Q13822 5/20 0.33
LPAR2 Q9HBW0 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22518658 0.89 SMN1; SMN2 (0.48) SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2
SCHEMBL22518659 0.89 SMN1; SMN2 (0.48) SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2
SCHEMBL29829381 0.87 ALDH1A1 (0.49) SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2
SCHEMBL15266 0.85 ALDH1A1 (0.51) SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2
SCHEMBL8921987 0.85 ALDH1A1 (0.51) SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2
SCHEMBL22518656 0.85 ALDH1A1 (0.51) SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2
SCHEMBL22518660 0.85 ALDH1A1 (0.51) SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2
SCHEMBL8921410 0.85 ALDH1A1 (0.51) SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2
SCHEMBL22518661 0.85 ALDH1A1 (0.51) SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2
SCHEMBL22518655 0.85 ALDH1A1 (0.51) SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0653472-B1 Curable organopolysiloxane composition containing adhesion promoter DOW CORNING TORAY SILICONE (JP) 2000-01-19 EP claimed
EP-3722329-B1 POLYSACCHARIDE DERIVATIVE KAO CORP (JP) 2024-10-16 EP disclosed
CN-111448220-B Polysaccharide derivatives 花王株式会社 2023-03-31 CN disclosed
US-11401350-B2 Polysaccharide derivative KAO CORPORATION (JP) 2022-08-02 US disclosed