Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FFAR3 | O14843 | 3/20 | 0.74 |
| ▸ | HDAC3 | O15379 | 3/20 | 0.74 |
| ▸ | HDAC1 | Q13547 | 3/20 | 0.74 |
| ▸ | HDAC2 | Q92769 | 3/20 | 0.74 |
| ▸ | HDAC8 | Q9BY41 | 3/20 | 0.74 |
| ▸ | CA1 | P00915 | 3/20 | 0.50 |
| ▸ | CES2 | O00748 | 1/20 | 0.48 |
| ▸ | CES1 | P23141 | 1/20 | 0.48 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.47 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.45 |
| ▸ | CA2 | P00918 | 3/20 | 0.43 |
| ▸ | BBOX1 | O75936 | 2/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Butyric Acid SCHEMBL30879925 | 1.00 | FFAR3 (0.74) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL6250020 | 0.95 | FFAR3 (0.74) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL2230696 | 0.95 | FFAR3 (0.74) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL8027476 | 0.95 | FFAR3 (0.74) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL1035581 | 0.89 | FFAR3 (0.82) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL31634767 | 0.89 | — | — | |
| Butyric Acid SCHEMBL60746 | 0.89 | FFAR3 (0.93) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL1330878 | 0.83 | — | — | |
| Butyric Acid SCHEMBL11419652 | 0.83 | FFAR3 (0.93) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL4292004 | 0.83 | FFAR3 (1.00) | FFAR3HDAC3HDAC1HDAC2HDAC8 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6022814-A | COATING A POLYSILOXANE/SILSESQUIOXANE ON THE SUBSTRATE; HEATING TO A TEMPERATURE RANGING FROM 250.DEGREE. C. TO THE GLASS TRANSITION POINT OF THE POLYMER; DIELECTRIC FILM OF LOW DENSITY AND A LARGE FREE VOLUME; HEAT RESISTANCE | KABUSHIKI KAISHA TOSHIBA (JP) | 2000-02-08 | — | — | US | disclosed |