Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FFAR3 | O14843 | 3/20 | 0.74 |
| ▸ | HDAC3 | O15379 | 3/20 | 0.74 |
| ▸ | HDAC1 | Q13547 | 3/20 | 0.74 |
| ▸ | HDAC2 | Q92769 | 3/20 | 0.74 |
| ▸ | HDAC8 | Q9BY41 | 3/20 | 0.74 |
| ▸ | CA1 | P00915 | 3/20 | 0.50 |
| ▸ | CES2 | O00748 | 1/20 | 0.48 |
| ▸ | CES1 | P23141 | 1/20 | 0.48 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.47 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.45 |
| ▸ | CA2 | P00918 | 3/20 | 0.43 |
| ▸ | BBOX1 | O75936 | 2/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Butyric Acid SCHEMBL6250020 | 1.00 | FFAR3 (0.74) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL8027476 | 0.95 | FFAR3 (0.74) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL8027475 | 0.95 | FFAR3 (0.74) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL30879925 | 0.95 | FFAR3 (0.74) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL487283 | 0.90 | FFAR3 (0.67) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL1035581 | 0.89 | FFAR3 (0.82) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL112217 | 0.89 | FFAR3 (0.93) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL11286276 | 0.86 | FFAR3 (0.88) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL9620629 | 0.86 | FFAR3 (0.88) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL28787739 | 0.83 | FFAR3 (0.82) | FFAR3HDAC3HDAC1HDAC2HDAC8 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8822076-B2 | Non-aqueous electrolytic secondary battery and positive electrode for non-aqueous electrolytic secondary battery | SANYO ELECTRIC CO., LTD. (JP) | 2014-09-02 | — | — | US | claimed |
| US-20110165453-A1 | NON-AQUEOUS ELECTROLYTIC SECONDARY BATTERY AND POSITIVE ELECTRODE FOR NON-AQUEOUS ELECTROLYTIC SECONDARY BATTERY | SANYO ELECTRIC CO., LTD. (JP) | 2011-07-07 | — | — | US | claimed |
| EP-0919593-B1 | Aromatic polyimide film having improved adhesion | UBE INDUSTRIES (JP) | 2004-04-07 | — | — | EP | claimed |
| US-6129982-A | HIGH HEAT RESISTANCE, LOW ELECTROCONDUCTIVITY, AND HIGH BONDING STRENGTH, USED FOR ELECTRONICS; ALUMINUM OR ALUMINUM OXIDE LAYERS ON BOTH SIDE OF AROMATIC POLYIMIDE FILM | UBE INDUSTRIES, LTD. (JP) | 2000-10-10 | — | — | US | claimed |
| EP-0919593-A1 | Aromatic polyimide film having improved adhesion | UBE INDUSTRIES, LTD. (JP) | 1999-06-02 | — | — | EP | claimed |
| JP-4027390-A | — | — | None | — | — | JP | disclosed |
| US-11566152-B2 | Adhesive strips | TESA SE (DE) | 2023-01-31 | — | — | US | disclosed |
| CN-115073988-A | Primer, coating agent set, cured product, and laminate | 荒川化学工业株式会社 | 2022-09-20 | — | — | CN | disclosed |
| US-11384263-B2 | Adhesive compound in particular for curved surfaces | TESA SE (DE) | 2022-07-12 | — | — | US | disclosed |
| US-20210179899-A1 | ADHESIVE COMPOUND IN PARTICULAR FOR CURVED SURFACES | TESA SE (DE) | 2021-06-17 | — | — | US | disclosed |
| CN-112631099-A | Image forming apparatus and process cartridge | 富士施乐株式会社 | 2021-04-09 | — | — | CN | disclosed |
| CN-112585224-A | Ink composition for plasma curing and additive for ink composition for plasma curing | 阪田油墨股份有限公司 | 2021-03-30 | — | — | CN | disclosed |
| US-5719214-A | FLEXIBILITY, TOUGHNESS MOLDING MATERIALS BLEND | JAPAN CORN STARCH CO., LTD. (JP) | 1998-02-17 | — | — | US | disclosed |
| US-5618555-A | SUSTAINED RELEASE OF BUPRENORPHINE (OR HYDROCHLORIDE SALT) | ITTO DENKO CORPORATION (JP) | 1997-04-08 | — | — | US | disclosed |
| US-5536584-A | SEMICONDUCTOR INTEGRATED CIRCUIT, TRANSISTOR AND A THIN FILM MULTILEVEL WIRING BOARD USES SURFACE PROTECTIVE COATING OF POLYIMIDE | HITACHI, LTD. (JP) | 1996-07-16 | — | — | US | disclosed |
| CN-1116525-A | Percutaneous absorption preparation | NITTO DENKO CORP (JP) | 1996-02-14 | — | — | CN | disclosed |
| EP-0680754-A2 | Percutaneous absorption preparation containing Buprenorphine | NITTO DENKO CORPORATION (JP) | 1995-11-08 | — | — | EP | disclosed |
| US-5416147-A | Hydrosilylative composition and process of hydrosilylation reaction | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1995-05-16 | — | — | US | disclosed |
| JP-H0427390-A | CARRIER FOR IMMOBILIZATION OF ENZYME, IMMOBILIZED ENZYME AND PRODUCTION THEREOF | KAO CORP | 1992-01-30 | — | — | JP | disclosed |
| EP-0091104-B1 | HEAT-RESISTANT SILICONE BLOCK POLYMER | Hitachi, Ltd. (JP) | 1986-09-24 | — | — | EP | disclosed |