SCHEMBL8033780

SCHEMBL8033780

CCCCCCCCCCCCCCCCCCCCCCCOP(=O)(O)O

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
LPAR3 Q9UBY5 14/20 1.00
LPAR2 Q9HBW0 10/20 1.00
LPAR1 Q92633 7/20 1.00
LPAR5 Q9H1C0 1/20 0.59
CYP3A4 P08684 1/20 0.52
SMPD1 P17405 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7942221 1.00 LPAR3 (1.00) LPAR3LPAR2LPAR1LPAR5CYP3A4
SCHEMBL29136 1.00 LPAR3 (1.00) LPAR3LPAR2LPAR1LPAR5CYP3A4
Hexadecyl Dihydrogen Phosphate SCHEMBL63748 1.00 LPAR3 (1.00) LPAR3LPAR2LPAR1LPAR5CYP3A4
SCHEMBL118839 1.00 LPAR3 (1.00) LPAR3LPAR2LPAR1LPAR5CYP3A4
Phosphoric Acid Monododecyl Ester SCHEMBL9437045 1.00 LPAR3 (1.00) LPAR3LPAR2LPAR1LPAR5CYP3A4
SCHEMBL1923668 1.00 LPAR3 (1.00) LPAR3LPAR2LPAR1LPAR5CYP3A4
Phosphoric Acid Monododecyl Ester SCHEMBL9316956 1.00 LPAR3 (1.00) LPAR3LPAR2LPAR1LPAR5CYP3A4
Phosphoric Acid Monododecyl Ester SCHEMBL11052336 1.00 LPAR3 (1.00) LPAR3LPAR2LPAR1LPAR5CYP3A4
SCHEMBL22325599 1.00 LPAR3 (1.00) LPAR3LPAR2LPAR1LPAR5CYP3A4
SCHEMBL9815356 1.00 LPAR3 (1.00) LPAR3LPAR2LPAR1LPAR5CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114920871-B Optical-grade polymethyl methacrylate resin and application thereof 万华化学集团股份有限公司 2023-09-19 CN claimed
CN-115768825-A Additive composition and use thereof, condensation polymer composition, moulding compound and moulded part produced therefrom and use thereof 弗劳恩霍夫应用研究促进协会 2023-03-07 CN claimed
CN-115461396-A Additive composition and use thereof, condensation polymer composition, moulding compound and moulded part produced therefrom and use thereof 弗劳恩霍夫应用研究促进协会 2022-12-09 CN claimed
CN-114920871-A Optical-grade polymethyl methacrylate resin and application thereof 万华化学集团股份有限公司 2022-08-19 CN claimed
US-11976157-B2 Polyol component for the production of PUR foams HUNTSMAN ADVANCED MATERIALS (Switz (CH) 2024-05-07 US disclosed
CN-115461396-A Additive composition and use thereof, condensation polymer composition, moulding compound and moulded part produced therefrom and use thereof 弗劳恩霍夫应用研究促进协会 2022-12-09 CN disclosed
CN-114920871-A Optical-grade polymethyl methacrylate resin and application thereof 万华化学集团股份有限公司 2022-08-19 CN disclosed
EP-0431585-B1 Silver halide photographic emulsion, method of manufacturing the same, and photographic light sensitive material FUJI PHOTO FILM CO LTD (JP) 2000-03-15 EP disclosed
US-5550014-A CONTAINING TABULAR SILVER HALIDE GRAINS HAVING ASPECT RATIO OF TWO OR MORE AND DISLOCATIONS CONCENTRATED ABOUT CORNER OF GRAIN FUJI PHOTO FILM CO., LTD. (JP) 1996-08-27 US disclosed
EP-0393579-B1 WATER BORNE METALLIC COATING COMPOSITION NIPPON PAINT CO., LTD. (JP) 1993-09-01 EP disclosed
US-5039343-A Water borne metallic coating composition NIPPON PAINT CO., LTD. (JP) 1991-08-13 US disclosed
EP-0431585-A1 Silver halide photographic emulsion, method of manufacturing the same, and photographic light sensitive material FUJI PHOTO FILM CO., LTD. (JP) 1991-06-12 EP disclosed
EP-0393579-A1 Water borne metallic coating composition NIPPON PAINT CO., LTD. (JP) 1990-10-24 EP disclosed
US-4870000-A Color photograhic recording material containing a coupler which releases a photographically active compound AGFA-GEVAERT AKTIENGESELLSCHAFT (DE) 1989-09-26 US disclosed