SCHEMBL8053928

SCHEMBL8053928

CC(O)C=CC(O)C(C)C

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.31
LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8053925 1.00 ALDH1A1 (0.31) ALDH1A1LMNA
SCHEMBL1931724 0.82
SCHEMBL29886820 0.82
SCHEMBL1931727 0.82
SCHEMBL8418779 0.73
SCHEMBL19758117 0.73
SCHEMBL14647818 0.73
SCHEMBL8418780 0.73
SCHEMBL19628368 0.73
SCHEMBL14049617 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6075060-A USEFUL IN LOWERING THE EQUILIBRIUM SURFACE TENSION OF AQUEOUS ORGANIC COMPOSITIONS, FOR EXAMPLE, THOSE USED IN COATINGS, INKS AND ADHESIVES AIR PRODUCTS AND CHEMICALS, INC. (US) 2000-06-13 US disclosed
EP-0940169-A1 Trans olefinic diols with surfactant properties AIR PRODUCTS AND CHEMICALS, INC. (US) 1999-09-08 EP disclosed
EP-0381056-A2 Impact resistant thermoplastic resin composition MITSUBISHI CHEMICAL CORPORATION (JP) 1990-08-08 EP disclosed
EP-0375177-A2 Thermoplastic resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1990-06-27 EP disclosed
EP-0357065-A2 Resin composition MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1990-03-07 EP disclosed
EP-0308255-A2 Process for making a thermoplastic resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1989-03-22 EP disclosed
EP-0270247-A2 Thermoplastic resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-06-08 EP disclosed
EP-0225170-A1 Moldable composition of polyphenylene ether and polyamide resin MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1987-06-10 EP disclosed