⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9814459 | 0.65 | — | — | |
| Hydrochloric Acid SCHEMBL11335869 | 0.65 | SMN1; SMN2 (0.33) | — | |
| SCHEMBL5094569 | 0.64 | MEN1 (0.34) | — | |
| SCHEMBL10672097 | 0.58 | KDM4E (0.34) | — | |
| SCHEMBL7182068 | 0.55 | MEN1 (0.33) | — | |
| SCHEMBL1526040 | 0.55 | — | — | |
| SCHEMBL9453223 | 0.55 | — | — | |
| SCHEMBL4312405 | 0.54 | — | — | |
| SCHEMBL14958479 | 0.54 | CA1 (0.30) | — | |
| SCHEMBL4026773 | 0.54 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117192895-A | Preparation method of positive photosensitive polyimide photoresist and photosensitive polyimide film | 西安思摩威新材料有限公司 | 2023-12-08 | — | — | CN | disclosed |
| CN-116774524-A | Photosensitive resin composition, method for producing pattern cured product, and use thereof | 武汉柔显科技股份有限公司 | 2023-09-19 | — | — | CN | disclosed |
| CN-110446974-B | Photosensitive composition, cured film, and organic EL display device | 东丽株式会社 | 2023-09-12 | — | — | CN | disclosed |
| CN-114326306-A | Photosensitive resin composition, photosensitive resin composition film, and patterned cured product | 武汉柔显科技股份有限公司 | 2022-04-12 | — | — | CN | disclosed |
| CN-112521296-B | Diamine compound, heat-resistant resin or heat-resistant resin precursor using same, photosensitive resin composition, cured film, and display device | 武汉柔显科技股份有限公司 | 2021-05-11 | — | — | CN | disclosed |
| CN-112521296-A | Diamine compound, heat-resistant resin or heat-resistant resin precursor using same, photosensitive resin composition, cured film, and display device | 武汉柔显科技股份有限公司 | 2021-03-19 | — | — | CN | disclosed |
| CN-108368263-B | Resin, paste, laminate obtained using the same, and method for producing the laminate | 东丽株式会社 | 2021-03-12 | — | — | CN | disclosed |
| EP-1023637-A1 | FRACTIONATED NOVOLAK RESIN COPOLYMER AND PHOTORESIST COMPOSITION THEREFROM | Clariant International Ltd. (CH) | 2000-08-02 | — | — | EP | disclosed |
| WO-1999017166-A1 | FRACTIONATED NOVOLAK RESIN COPOLYMER AND PHOTORESIST COMPOSITION THEREFROM | CLARIANT INTERNATIONAL, LTD. (CH) | 1999-04-08 | — | — | WO | disclosed |