SCHEMBL8082801

SCHEMBL8082801

CCC/C=C/C(CC(=O)O)C(=O)O

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC2 Q92769 1/20 0.39
GRIK1 P39086 1/20 0.37
GRIK2 Q13002 1/20 0.37
TDP1 Q9NUW8 1/20 0.34
TAS1R3 Q7RTX0 1/20 0.34
TAS1R1 Q7RTX1 1/20 0.34
EPHX2 P34913 2/20 0.34
GMNN O75496 1/20 0.33
USP2 O75604 1/20 0.33
LMNA P02545 1/20 0.33
CYP1A2 P05177 1/20 0.33
POLB P06746 1/20 0.33
MAPT P10636 1/20 0.33
CYP2C9 P11712 1/20 0.33
ALOX15 P16050 1/20 0.33
APEX1 P27695 1/20 0.33
CYP2C19 P33261 1/20 0.33
RECQL P46063 1/20 0.33
BLM P54132 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8082802 1.00 HDAC2 (0.39) HDAC2GRIK1GRIK2TDP1TAS1R3
SCHEMBL29963090 1.00 HDAC2 (0.39) HDAC2GRIK1GRIK2TDP1TAS1R3
SCHEMBL1021948 0.89 F7 (0.47) TDP1EPHX2GMNNUSP2LMNA
SCHEMBL29962462 0.89 F7 (0.47) TDP1EPHX2GMNNUSP2LMNA
SCHEMBL1021947 0.89 F7 (0.47) TDP1EPHX2GMNNUSP2LMNA
SCHEMBL7901334 0.87 PPARG (0.50) TDP1GMNNUSP2LMNACYP1A2
SCHEMBL29962071 0.87 PPARG (0.50) TDP1GMNNUSP2LMNACYP1A2
SCHEMBL7901336 0.87 PPARG (0.50) TDP1GMNNUSP2LMNACYP1A2
SCHEMBL13975269 0.86 GRIK1 (0.36) HDAC2GRIK1GRIK2TDP1TAS1R3
SCHEMBL23748039 0.85 TERT (0.53) TDP1GMNNUSP2LMNACYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4725989-A1 RESIN COMPOSITION, MOLDED BODY USING SAME, AND METHOD FOR PRODUCING RESIN COMPOSITION Shiraishi Central Laboratories Co., Ltd. (JP) 2026-04-15 EP disclosed
WO-2023074691-A1 RESIN COMPOSITION, MOLDED BODY USING THIS, AND PRODUCTION METHOD OF RESIN COMPOSITION 国立大学法人京都大学 2023-05-04 WO disclosed
WO-2023274335-A1 LUBRICITY IMPROVER COMPOSITION FOR FUEL OIL AND USE THEREOF 中国石油化工股份有限公司 2023-01-05 WO disclosed
CN-115362246-A Cleaning agent composition and method for producing processed semiconductor substrate 日产化学株式会社 2022-11-18 CN disclosed
CN-113845946-A Fuel additive, preparation method thereof and fuel composition 中国石油化工股份有限公司 2021-12-28 CN disclosed
JP-2000265103-A BINDER FOR PRINTING INK SANYO CHEM IND LTD 2000-09-26 JP disclosed