SCHEMBL8086203

SCHEMBL8086203

CC1=C(C)C(C)(C)C([Zr](C)C)=C1C

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CTSD P07339 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL7176350 0.97 CTSD (0.31) CTSD
SCHEMBL4447422 0.83 CTSD (0.32) CTSD
SCHEMBL4447417 0.83 CTSD (0.32) CTSD
SCHEMBL6273574 0.76 CTSD (0.31) CTSD
SCHEMBL2232942 0.72
SCHEMBL2230540 0.71 CTSD (0.43) CTSD
Fluoride SCHEMBL2232996 0.70
Hydrochloric Acid SCHEMBL2232484 0.70
Bromide SCHEMBL2232352 0.70
Methyl Alcohol SCHEMBL2232478 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119431631-A Ultra-high molecular weight polyethylene powder and molded article 旭化成株式会社 2025-02-14 CN disclosed
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
WO-2024018999-A1 POLYMER COMPOUND 国立大学法人九州大学 2024-01-25 WO disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
EP-3492982-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-11-11 EP disclosed
EP-3492982-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2019-06-05 EP disclosed
US-6114556-A Metallocene compound and its use as catalyst component TARGOR GMBH (DE) 2000-09-05 US disclosed