⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2605832 | 0.85 | — | — | |
| SCHEMBL3479871 | 0.80 | PDE3B (0.34) | — | |
| Naphthalene SCHEMBL27907153 | 0.73 | CYP2A6 (0.40) | — | |
| SCHEMBL13518555 | 0.69 | — | — | |
| SCHEMBL352540 | 0.68 | — | — | |
| SCHEMBL11880449 | 0.68 | — | — | |
| SCHEMBL3876163 | 0.68 | — | — | |
| SCHEMBL22713655 | 0.67 | — | — | |
| SCHEMBL8766240 | 0.65 | — | — | |
| SCHEMBL1663218 | 0.65 | HSP90AA1 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5470622-A | Positioning a flexible layer of thermosetting adhesive and curing to enclose a substrate | RAYCHEM CORPORATION (US) | 1995-11-28 | — | — | US | claimed |
| EP-0556290-A4 | ENCLOSING A SUBSTRATE WITH A HEAT-RECOVERABLE ARTICLE | — | 1993-11-18 | — | — | EP | claimed |
| EP-0556290-A1 | ENCLOSING A SUBSTRATE WITH A HEAT-RECOVERABLE ARTICLE. | RAYCHEM CORP (US) | 1993-08-25 | — | — | EP | claimed |
| WO-1992008073-A1 | ENCLOSING A SUBSTRATE WITH A HEAT-RECOVERABLE ARTICLE | RAYCHEM CORPORATION (US) | 1992-05-14 | — | — | WO | claimed |
| CN-119856252-A | Method for manufacturing semiconductor device and adhesive film for processing semiconductor wafer | 株式会社力森诺科 | 2025-04-18 | — | — | CN | disclosed |
| CN-119856251-A | Method for manufacturing semiconductor device and adhesive film for processing semiconductor wafer | 株式会社力森诺科 | 2025-04-18 | — | — | CN | disclosed |
| CN-115298280-B | Adhesive for semiconductor, semiconductor device and method for manufacturing the same | 株式会社力森诺科 | 2025-04-08 | — | — | CN | disclosed |
| CN-119592277-A | Adhesive for semiconductor, method for manufacturing semiconductor device, and semiconductor device | 株式会社力森诺科 | 2025-03-11 | — | — | CN | disclosed |
| CN-112673715-B | Electronic component and method for manufacturing electronic component | 株式会社力森诺科 | 2025-03-07 | — | — | CN | disclosed |
| CN-119547192-A | Method for manufacturing semiconductor device | 株式会社力森诺科 | 2025-02-28 | — | — | CN | disclosed |
| CN-112771659-B | Adhesive for semiconductor, method for manufacturing semiconductor device, and semiconductor device | 株式会社力森诺科 | 2025-02-21 | — | — | CN | disclosed |
| CN-112930584-B | Method for manufacturing semiconductor device and adhesive film for processing semiconductor wafer | 株式会社力森诺科 | 2024-11-15 | — | — | CN | disclosed |
| US-6059908-A | Method for protecting substrates | NV RAYCHEM SA (BE) | 2000-05-09 | — | — | US | disclosed |
| EP-0725911-A1 | ARTICLE AND METHOD FOR PROTECTING SUBSTRATES | N.V. RAYCHEM S.A. (BE) | 1996-08-14 | — | — | EP | disclosed |
| EP-0556290-B1 | ENCLOSING A SUBSTRATE WITH A HEAT-RECOVERABLE ARTICLE | RAYCHEM CORP (US) | 1996-06-12 | — | — | EP | disclosed |
| US-5470622-A | Positioning a flexible layer of thermosetting adhesive and curing to enclose a substrate | RAYCHEM CORPORATION (US) | 1995-11-28 | — | — | US | disclosed |
| WO-1995012087-A1 | ARTICLE AND METHOD FOR PROTECTING SUBSTRATES | N.V. RAYCHEM S.A. (BE) | 1995-05-04 | — | — | WO | disclosed |
| EP-0556290-A4 | ENCLOSING A SUBSTRATE WITH A HEAT-RECOVERABLE ARTICLE | — | 1993-11-18 | — | — | EP | disclosed |
| EP-0556290-A1 | ENCLOSING A SUBSTRATE WITH A HEAT-RECOVERABLE ARTICLE. | RAYCHEM CORP (US) | 1993-08-25 | — | — | EP | disclosed |
| WO-1992008073-A1 | ENCLOSING A SUBSTRATE WITH A HEAT-RECOVERABLE ARTICLE | RAYCHEM CORPORATION (US) | 1992-05-14 | — | — | WO | disclosed |