Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PDE3B | Q13370 | 2/20 | 0.34 |
| ▸ | PDE3A | Q14432 | 2/20 | 0.34 |
| ▸ | GRIN2D | O15399 | 1/20 | 0.31 |
| ▸ | GRIN3B | O60391 | 1/20 | 0.31 |
| ▸ | GRIN1 | Q05586 | 1/20 | 0.31 |
| ▸ | GRIN2A | Q12879 | 1/20 | 0.31 |
| ▸ | GRIN2B | Q13224 | 1/20 | 0.31 |
| ▸ | GRIN2C | Q14957 | 1/20 | 0.31 |
| ▸ | GRIN3A | Q8TCU5 | 1/20 | 0.31 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2605832 | 0.83 | — | — | |
| SCHEMBL8091880 | 0.80 | — | — | |
| Cyanide SCHEMBL29895314 | 0.79 | HSP90AA1 (0.35) | — | |
| SCHEMBL1821183 | 0.72 | PDE3B (0.33) | PDE3BPDE3A | |
| SCHEMBL3798661 | 0.72 | PDE3B (0.33) | PDE3BPDE3A | |
| Urea SCHEMBL28800425 | 0.72 | P2RX7 (0.32) | — | |
| Naphthalene SCHEMBL27907153 | 0.71 | CYP2A6 (0.40) | — | |
| SCHEMBL28960215 | 0.70 | — | — | |
| Trimethylammonium SCHEMBL28227900 | 0.69 | CA1 (0.33) | — | |
| Propane SCHEMBL28202952 | 0.66 | TYMP (0.39) | GRIN2DGRIN3BGRIN1GRIN2AGRIN2B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 285 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112724867-B | Insulating adhesive film material and preparation method and application thereof | 深圳先进技术研究院 | 2023-01-10 | — | — | CN | claimed |
| CN-110804412-B | High-frequency low-loss insulating adhesive film material and preparation method thereof | 中国科学院深圳先进技术研究院 | 2021-11-05 | — | — | CN | claimed |
| CN-112724867-A | Insulating adhesive film material and preparation method and application thereof | 深圳先进技术研究院 | 2021-04-30 | — | — | CN | claimed |
| CN-110804412-A | High-frequency low-loss insulating adhesive film material and preparation method thereof | 中国科学院深圳先进技术研究院 | 2020-02-18 | — | — | CN | claimed |
| CN-103797083-B | The BMI of softness, benzimidazole dihydrochloride, epoxy anhydride adduct mixed adhesive | 宝特威韩国株式会社 | 2016-07-27 | — | — | CN | claimed |
| CN-103797083-A | Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive | PROTAVIC KOREA CO LTD | 2014-05-14 | — | — | CN | claimed |
| US-20050026069-A1 | Solventless thermosetting photosensitive via-filling material | YEH TODD (TW) | 2005-02-03 | — | — | US | claimed |
| JP-8325349-A | — | — | None | — | — | JP | disclosed |
| EP-4015545-B1 | ACRYLIC RUBBER, CROSSLINKABLE RUBBER COMPOSITION, AND RUBBER CURED PRODUCT | DENKA COMPANY LTD (JP) | 2024-05-29 | — | — | EP | disclosed |
| CN-117413022-A | Composition, method for producing cured product, and cured product | 株式会社ADEKA | 2024-01-16 | — | — | CN | disclosed |
| CN-116997831-A | Optical functional film for head-up display, optical laminate, functional glass, and head-up display system | 日本化药株式会社 | 2023-11-03 | — | — | CN | disclosed |
| CN-116648479-A | Insulating resin composition, cured product, coil for rotary machine, and rotary machine | 三菱电机株式会社 | 2023-08-25 | — | — | CN | disclosed |
| CN-111690355-B | Sealant for display and liquid crystal display | 日本化药株式会社 | 2023-06-13 | — | — | CN | disclosed |
| EP-0642416-B1 | FIBER/RESIN COMPOSITES AND METHOD OF PREPARATION | LOCTITE CORP (US) | 2003-10-01 | — | — | EP | disclosed |
| CN-1439038-A | Epoxyresin composition and cured object obtained therefrom | NIPPON KAYAKU KK (JP) | 2003-08-27 | — | — | CN | disclosed |
| EP-0626948-B1 | NEW CURING AGENTS/ACCELERATORS FOR EPOXY RESINS, CURABLE COMPOSITIONS AND PROCESSES | REILLY IND INC (US) | 1997-11-12 | — | — | EP | disclosed |
| JP-H08325349-A | EPOXY RESIN COMPOSITION AND REINFORCING ADHESIVE SHEET USING THE SAME | NITTO DENKO CORP | 1996-12-10 | — | — | JP | disclosed |
| EP-0728165-A1 | TOPOGRAPHICAL METHOD | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1996-08-28 | — | — | EP | disclosed |
| US-5420223-A | Dimethylaminopyridine salts and epoxy resins for coatings | REILLY INDUSTRIES, INC. (US) | 1995-05-30 | — | — | US | disclosed |
| WO-1995013327-A1 | TOPOGRAPHICAL METHOD | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1995-05-18 | — | — | WO | disclosed |