SCHEMBL80963

SCHEMBL80963

BrC(Br)c1nc(C(Br)Br)nc(C(Br)Br)n1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11744176 0.79 CASP1 (0.33)
SCHEMBL3517644 0.74 MEN1 (0.32)
SCHEMBL6897402 0.67 TSHR (0.33)
SCHEMBL4099364 0.65
SCHEMBL4352 0.52
SCHEMBL4252284 0.48
Ammonia Solution, Strong SCHEMBL4182902 0.48
Bromoform SCHEMBL18691 0.47
Bromoform SCHEMBL8874563 0.47
Bromoform SCHEMBL30241098 0.42

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 954 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119668028-A Negative photoresist composition, application thereof and imaging method 福建泓光半导体材料有限公司 2025-03-21 CN claimed
US-4359524-A ANTIHALATION LAYER OF HALOGEN COMPOUND AND MEROCYANIN DYE FUJI PHOTO FILM CO., LTD. (JP) 1982-11-16 US claimed
CN-122072436-A Negative photosensitive resin composition, cured film, and resist film DIC株式会社 2026-05-22 CN disclosed
US-12422750-B2 Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device FUJIFILM CORPORATION (JP) 2025-09-23 US disclosed
CN-116648313-B Resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2025-05-16 CN disclosed
CN-119937247-A Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2025-05-06 CN disclosed
CN-119668028-A Negative photoresist composition, application thereof and imaging method 福建泓光半导体材料有限公司 2025-03-21 CN disclosed
CN-119575759-A Positive photosensitive resin composition, photosensitive film, resist underlayer film, resist permanent film, and method for producing film DIC株式会社 2025-03-07 CN disclosed
CN-115190891-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-10-15 CN disclosed
CN-111566560-B Photosensitive resin composition, partition wall, organic electroluminescent element, image display device, and illumination 三菱化学株式会社 2024-09-17 CN disclosed
CN-114981360-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-09-10 CN disclosed
US-4311782-A POLYETHER OF ORTHOCARBOXYLIC ESTER HOECHST AKTIENGESELLSCHAFT (DE) 1982-01-19 US disclosed
US-4259432-A HIGH SENSITIVITY TO ULTRAVIOLET RADIATION AND ARGON LASER RAYS FUJI PHOTO FILM CO., LTD. (JP) 1981-03-31 US disclosed
US-4258123-A UNSATURATED COMPOUND, HALOGENATED TRIAZINE, UNSATURATED KETONE FUJI PHOTO FILM CO., LTD. (JP) 1981-03-24 US disclosed
US-4250247-A COMPRISING AN ACID-FORMING COMPOUND AND A COMPOUND HAVING AS AN ACID-CLEAVABLE GROUP AN N-ACYLIMINOCARBONATE; RELIEF IMAGES; OFFSET PRINTING HOECHST AKTIENGESELLSCHAFT (DE) 1981-02-10 US disclosed
US-4248957-A ENOL ETHER CONTAINING COMPOUND OF WHICH THE SOLUBILITY IN DEVELOPER INCREASES ON CLEAVAGE HOECHST AKTIENGESELLSCHAFT (DE) 1981-02-03 US disclosed
US-4247611-A ACETAL RESIN, ACID DONER HOECHST AKTIENGESELLSCHAFT (DE) 1981-01-27 US disclosed
EP-0006626-A2 Radiation-sensitive mixture and process for producing relief images HOECHST AKTIENGESELLSCHAFT (DE) 1980-01-09 EP disclosed
EP-0006627-A2 Radiation-sensitive mixture and process for producing relief images HOECHST AKTIENGESELLSCHAFT (DE) 1980-01-09 EP disclosed
US-4101323-A Radiation-sensitive copying composition HOECHST AKTIENGESELLSCHAFT (DE) 1978-07-18 US disclosed