SCHEMBL8097847

SCHEMBL8097847

CC(C)(O)N1C(=O)C=CC1=O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 6/20 0.41
GSK3A P49840 2/20 0.41
GSK3B P49841 2/20 0.41
ALDH1A1 P00352 2/20 0.36
BLM P54132 2/20 0.36
NPSR1 Q6W5P4 2/20 0.36
GMNN O75496 1/20 0.36
LMNA P02545 1/20 0.36
MAPT P10636 1/20 0.36
THPO P40225 1/20 0.36
PMP22 Q01453 1/20 0.36
FAAH O00519 2/20 0.32
CYP1A2 P05177 1/20 0.31
HPGD P15428 1/20 0.31
CYP2C19 P33261 1/20 0.31
WRN Q14191 1/20 0.31
HIF1A Q16665 1/20 0.31
HSP90AA1 P07900 2/20 0.31
CCR6 P51684 1/20 0.31
PKM P14618 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL709031 0.83 MGLL (0.41) MGLLGSK3AGSK3BALDH1A1BLM
SCHEMBL17924837 0.79 MGLL (0.38) MGLLGSK3AGSK3BALDH1A1BLM
SCHEMBL17924887 0.79 MGLL (0.38) MGLLGSK3AGSK3BALDH1A1BLM
SCHEMBL9774898 0.77 MGLL (0.45) MGLLGSK3AGSK3BALDH1A1BLM
SCHEMBL17653538 0.77 MGLL (0.38) MGLLGSK3AGSK3BALDH1A1BLM
SCHEMBL152557 0.77 MGLL (0.45) MGLLGSK3AGSK3BALDH1A1BLM
SCHEMBL17924903 0.75 MGLL (0.35) MGLLGSK3AGSK3BALDH1A1BLM
SCHEMBL13632716 0.75 MGLL (0.41) MGLLGSK3AGSK3BALDH1A1BLM
SCHEMBL11509113 0.74 MGLL (0.38) MGLLGSK3AGSK3BALDH1A1BLM
SCHEMBL17897015 0.74 MGLL (0.34) MGLLGSK3AGSK3BALDH1A1BLM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6165672-A Maleimide or alicyclic olefin-based monomers, copolymer resin of these monomers and photoresist using the resin HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) 2000-12-26 US claimed
US-20160209743-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING MEMBER HAVING CURVED SHAPE, PHOTOSENSITIVE RESIN FILM FOR FORMING MEMBER HAVING CURVED SHAPE USING SAID COMPOSITION, AND LENS MEMBER MANUFACTRED USING SAID COMPOSITION OR SAID FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-07-21 US disclosed
US-6165672-A Maleimide or alicyclic olefin-based monomers, copolymer resin of these monomers and photoresist using the resin HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) 2000-12-26 US disclosed
EP-0601974-B1 Positive photoresist with better properties OCG MICROELECTRONIC MATERIALS (US) 1997-05-28 EP disclosed
US-5558978-A Photoresist compositions containing copolymers having acid-labile groups and recurring units derived from either N-(hydroxymethyl)maleimide or N-(acetoxymethyl)maleimide or both OCG MICROELECTRONIC MATERIALS, INC. (US) 1996-09-24 US disclosed
EP-0659781-A2 Copolymers of maleimide, for photoresists OCG Microelectronic Materials Inc. (US) 1995-06-28 EP disclosed
US-5397680-A Light sensitive elements with maleimide monomers and styrene derivatives polymers CIBA-GEIGY AG (CH) 1995-03-14 US disclosed
US-5369200-A Positive photoresist having improved processing properties CIBA-GEIGY AG (CH) 1994-11-29 US disclosed
EP-0601974-A1 Positive photoresist with better properties OCG Microelectronic Materials Inc. (US) 1994-06-15 EP disclosed