SCHEMBL812608

SCHEMBL812608

CCC(N(OC)OC)[SiH](OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23282516 0.80
SCHEMBL5074361 0.77
SCHEMBL107944 0.71
SCHEMBL329152 0.70
SCHEMBL1138224 0.69
SCHEMBL775012 0.67
SCHEMBL5916953 0.66
SCHEMBL1138390 0.66 DNM1 (0.37)
SCHEMBL19732756 0.65
SCHEMBL1608598 0.64 TSHR (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12584012-B2 Inorganic filler dispersion stabilizer, inorganic filler-containing resin composition, molded article, and additive DIC CORPORATION (JP) 2026-03-24 US disclosed
US-20260049229-A1 STRUCTURE CLADDING STRUCTURE, COATING COMPOSITION, AND METHOD FOR MANUFACTURING SAME KEIWA INCORPORATED (JP) 2026-02-19 US disclosed
US-12503570-B2 Inorganic filler fluidity modifier, inorganic filler-containing resin composition and molded article of resin composition DIC CORPORATION (JP) 2025-12-23 US disclosed
EP-3858941-B1 FLUIDITY MODIFIER, COMPOSITION CONTAINING SAME, AND CURED PRODUCT OF SAID COMPOSITION DAINIPPON INK & CHEMICALS (JP) 2025-10-15 EP disclosed
US-12110389-B2 Fluidity modifier, composition containing same, and cured product of said composition DIC CORPORATION (JP) 2024-10-08 US disclosed
WO-2024116572-A1 IMIDE GROUP-CONTAINING RESIN 東洋紡エムシー株式会社 2024-06-06 WO disclosed
WO-2024116571-A1 ADHESIVE COMPOSITION 東洋紡エムシー株式会社 2024-06-06 WO disclosed
US-20240101786-A1 INORGANIC FILLER FLUIDITY MODIFIER, INORGANIC FILLER-CONTAINING RESIN COMPOSITION AND MOLDED ARTICLE OF RESIN COMPOSITION DIC CORPORATION (JP) 2024-03-28 US disclosed
EP-4303268-A1 INORGANIC FILLER FLUIDITY MODIFIER, INORGANIC FILLER-CONTAINING RESIN COMPOSITION AND MOLDED ARTICLE OF RESIN COMPOSITION DIC CORPORATION (JP) 2024-01-10 EP disclosed
WO-2023204033-A1 MODIFIER FOR FLUIDITY OF INORGANIC FILLER, COMPOSITION CONTAINING INORGANIC FILLER, AND HEAT-CONDUCTIVE SILICONE SHEET DIC株式会社 2023-10-26 WO disclosed
US-20120088859-A1 CURABLE RESIN COMPOSITION KANEKA CORPORATION (JP) 2012-04-12 US disclosed
US-7968667-B2 Adhesive compositions for optical fibers THE YOKOHAMA RUBBER CO., LTD. (JP) 2011-06-28 US disclosed
US-20110003920-A1 TIRE-WHEEL ASSEMBLY AND DISASSEMBLY METHOD FOR THE SAME THE YOKOHAMA RUBBER CO. 2011-01-06 US disclosed
US-20100324254-A1 REACTIVE HOT MELT ADHESIVE THE YOKOHAMA RUBBER CO., LTD. (JP) 2010-12-23 US disclosed
US-20090035580-A1 ELECTROPEELING COMPOSITION, AND MAKING USE OF THE SAME, ADHESIVE AND ELECTROPEELING MULTILAYER ADHESIVE THE YOKOHAMA RUBBER CO., LTD. (JP) 2009-02-05 US disclosed
US-20080319142-A1 Adhesive Composition THE YOKOHAMA RUBBER CO., LTD. (JP) 2008-12-25 US disclosed
EP-1914285-A1 ELECTROPEELING COMPOSITION, AND MAKING USE OF THE SAME, ADHESIVE AND ELECTROPEELING MULTILAYER ADHESIVE The Yokohama Rubber Co., Ltd. (JP) 2008-04-23 EP disclosed
US-20080009562-A1 Adhesive Compositions for Optical Fibers Mitachi, Seiko (JP) 2008-01-10 US disclosed
EP-1788060-A1 ADHESIVE COMPOSITION THE YOKOHAMA RUBBER CO., LTD. (JP) 2007-05-23 EP disclosed
EP-1788059-A1 ADHESIVE COMPOSITIONS FOR OPTICAL FIBERS THE YOKOHAMA RUBBER CO., LTD. (JP) 2007-05-23 EP disclosed