⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16970030 | 0.81 | — | — | |
| SCHEMBL16969707 | 0.81 | — | — | |
| SCHEMBL195946 | 0.80 | — | — | |
| SCHEMBL16969585 | 0.79 | ALDH1A1 (0.32) | — | |
| SCHEMBL9614314 | 0.78 | ALDH1A1 (0.33) | — | |
| Water SCHEMBL29080233 | 0.78 | — | — | |
| SCHEMBL16969591 | 0.77 | ALDH1A1 (0.33) | — | |
| SCHEMBL16969760 | 0.77 | ALDH1A1 (0.33) | — | |
| SCHEMBL16970047 | 0.77 | ALDH1A1 (0.33) | — | |
| SCHEMBL16970046 | 0.77 | ALDH1A1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-8176035-A | — | — | None | — | — | JP | disclosed |
| CN-104816104-B | Ag balls, Ag cores ball, scaling powder coating Ag balls, scaling powder coating Ag cores ball, solder joints, forming solder, soldering paste | 千住金属工业株式会社 | 2018-07-03 | — | — | CN | disclosed |
| EP-2905349-B1 | Ag ball, solder joint, formed solder, solder paste and silver paste | SENJU METAL INDUSTRY CO (JP) | 2017-05-17 | — | — | EP | disclosed |
| US-9266196-B2 | Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2016-02-23 | — | — | US | disclosed |
| EP-2905349-A2 | Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2015-08-12 | — | — | EP | disclosed |
| US-20150217409-A1 | Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE | Senju Metal lndustry Co., Ltd. (JP) | 2015-08-06 | — | — | US | disclosed |
| CN-104816104-A | Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste | SENJU METAL INDUSTRY CO | 2015-08-05 | — | — | CN | disclosed |
| US-6103941-A | HYDROGENATION OF 1,3-BUTADIENE DIEPOXIDE | BASF AKTIENGESELLSCHAFT (DE) | 2000-08-15 | — | — | US | disclosed |
| US-5977417-A | Preparation of 1,4-butanediol | BASF AKTIENGESELLSCHAFT (DE) | 1999-11-02 | — | — | US | disclosed |
| JP-H08176035-A | PRODUCTION OF 1,4-BUTANEDIOL | BASF AG | 1996-07-09 | — | — | JP | disclosed |
| US-5457241-A | Polyalk-1-enyl ethers | ISP INVESTMENTS INC. (US) | 1995-10-10 | — | — | US | disclosed |
| US-5334772-A | Polyalk-1-enyl ethers | ISP INVESTMENTS INC. (US) | 1994-08-02 | — | — | US | disclosed |
| EP-0494946-A4 | ALK-1-ENYL ETHERS | — | 1993-09-22 | — | — | EP | disclosed |
| US-5227533-A | Alk-1-enyl ethers | ISP INVESTMENTS INC. (US) | 1993-07-13 | — | — | US | disclosed |
| US-5225606-A | Alk-1-enyl ethers | ISP INVESTMENTS INC. (US) | 1993-07-06 | — | — | US | disclosed |
| US-5200437-A | Radiation or thermally curable molding resins comprsing reaction product of hydroxylated compound, alk-w-enyloxy oxirane and alkyl epoxide with diluents, photoinitiator | ISP INVESTMENTS INC. (US) | 1993-04-06 | — | — | US | disclosed |
| EP-0494946-A1 | ALK-1-ENYL ETHERS | ISP INVESTMENTS INC (US) | 1992-07-22 | — | — | EP | disclosed |
| WO-1991004957-A1 | ALK-1-ENYL ETHERS | GAF CHEMICALS CORPORATION (US) | 1991-04-18 | — | — | WO | disclosed |