Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.78 |
| ▸ | LMNA | P02545 | 1/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 5/20 | 0.45 |
| ▸ | TSHR | P16473 | 3/20 | 0.45 |
| ▸ | ATM | Q13315 | 1/20 | 0.43 |
| ▸ | CA2 | P00918 | 5/20 | 0.42 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.42 |
| ▸ | MMP9 | P14780 | 1/20 | 0.37 |
| ▸ | MMP8 | P22894 | 1/20 | 0.37 |
| ▸ | MMP14 | P50281 | 1/20 | 0.37 |
| ▸ | RECQL | P46063 | 1/20 | 0.36 |
| ▸ | CA1 | P00915 | 1/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.34 |
| ▸ | USP2 | O75604 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9492501 | 0.89 | — | — | |
| SCHEMBL16324 | 0.89 | — | — | |
| SCHEMBL8420801 | 0.89 | — | — | |
| SCHEMBL6249719 | 0.89 | ALDH1A1 (1.00) | ALDH1A1LMNATDP1CYP3A4TSHR | |
| 2-Ethoxyethanol SCHEMBL2125994 | 0.88 | ALDH1A1 (0.67) | ALDH1A1LMNATDP1CYP3A4TSHR | |
| Ether SCHEMBL729667 | 0.88 | ALDH1A1 (0.60) | ALDH1A1LMNATDP1CYP3A4TSHR | |
| SCHEMBL21625614 | 0.86 | ALDH1A1 (0.86) | ALDH1A1LMNATDP1CYP3A4TSHR | |
| SCHEMBL23087843 | 0.86 | ALDH1A1 (0.95) | ALDH1A1LMNATDP1CYP3A4TSHR | |
| SCHEMBL7199575 | 0.86 | ALDH1A1 (0.95) | ALDH1A1LMNATDP1CYP3A4TSHR | |
| SCHEMBL4083194 | 0.86 | ALDH1A1 (0.95) | ALDH1A1LMNATDP1CYP3A4TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20190002626-A1 | HEAT-CURING EPOXY RESIN COMPOSITION CONTAINING NON-AROMATIC UREAS AS ACCELERATOR | SIKA TECHNOLOGY AG (CH) | 2019-01-03 | — | — | US | claimed |
| WO-2024126186-A1 | ONE-COMPONENT CATIONIC POLYMERIZABLE COMPOSITION | HUNTSMAN ADVANCED MATERIALS LICENSING (SWITZERLAND) GMBH (CH) | 2024-06-20 | — | — | WO | disclosed |
| US-11198754-B2 | Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator | SIKA TECHNOLOGY AG (CH) | 2021-12-14 | — | — | US | disclosed |
| US-20190002626-A1 | HEAT-CURING EPOXY RESIN COMPOSITION CONTAINING NON-AROMATIC UREAS AS ACCELERATOR | SIKA TECHNOLOGY AG (CH) | 2019-01-03 | — | — | US | disclosed |
| CN-104395416-B | Primer coating composition for aluminum wheel hub | 关西涂料株式会社 | 2018-05-22 | — | — | CN | disclosed |
| US-20180079852-A1 | POLYISOCYANATE COMPOSITION BASED ON 1,5-PENTAMETHYLENE DIISOCYANATE | COVESTRO DEUTSCHLAND (DE) | 2018-03-22 | — | — | US | disclosed |
| US-9221969-B2 | Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures | SIKA TECHNOLOGY AG (CH) | 2015-12-29 | — | — | US | disclosed |
| US-8076424-B2 | Heat-curable compositions comprising low-temperature impact strength modifiers | SIKA TECHNOLOGY AG (CH) | 2011-12-13 | — | — | US | disclosed |
| US-8062468-B2 | Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins | SIKA TECHNOLOGY AG (CH) | 2011-11-22 | — | — | US | disclosed |
| US-20100273005-A1 | HEAT-CURING EPOXY RESIN COMPOSITION CONTAINING NON-AROMATIC UREAS AS ACCELERATOR | SIKA TECHNOLOGY AG (CH) | 2010-10-28 | — | — | US | disclosed |
| US-20100116433-A1 | Low-Temperature Impact Resistant Thermosetting Epoxide Resin Compositions With Solid Epoxide Resins | SIKA TECHNOLOGY AG (CH) | 2010-05-13 | — | — | US | disclosed |
| US-20090324958-A1 | Heat Setting Compounds Suitable for Sticking Together Coated Substrates | SIKA TECHNOLOGY AG (CH) | 2009-12-31 | — | — | US | disclosed |
| US-20070105983-A1 | Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures | SIKA TECHNOLOGY AG (CH) | 2007-05-10 | — | — | US | disclosed |
| US-20070066721-A1 | Heat-curable compositions comprising low-temperature impact strength modifiers | SIKA TECHNOLOGY AG (CH) | 2007-03-22 | — | — | US | disclosed |