SCHEMBL819283

SCHEMBL819283

Cc1ccc(Oc2ccc(C(C)(C)c3ccc(Oc4ccc(C)cc4)cc3)cc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TEAD4 Q15561 1/20 0.54
MAPT P10636 5/20 0.52
ALDH1A1 P00352 4/20 0.52
POLB P06746 1/20 0.52
TDP1 Q9NUW8 1/20 0.52
TSHR P16473 4/20 0.50
HPGD P15428 4/20 0.48
NPC1 O15118 2/20 0.48
RAB9A P51151 2/20 0.48
MAPK1 P28482 1/20 0.48
MMP13 P45452 2/20 0.47
MEN1 O00255 2/20 0.46
KMT2A Q03164 2/20 0.46
ACHE P22303 1/20 0.44
SMN1; SMN2 Q16637 3/20 0.42
HTT P42858 1/20 0.42
AR P10275 2/20 0.42
SLC6A4 P31645 2/20 0.42
ESR1 P03372 1/20 0.42
CYP3A4 P08684 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12387086 1.00 TEAD4 (0.54) TEAD4MAPTALDH1A1POLBTDP1
SCHEMBL3432481 1.00 TEAD4 (0.54) TEAD4MAPTALDH1A1POLBTDP1
SCHEMBL22738826 0.94 TEAD4 (0.48) TEAD4MAPTALDH1A1POLBTDP1
SCHEMBL13188093 0.92 ACHE (0.60) TEAD4MAPTALDH1A1POLBTDP1
SCHEMBL15308162 0.92 SMN1; SMN2 (0.55) TEAD4MAPTALDH1A1POLBTDP1
SCHEMBL12277256 0.92 ACHE (0.60) TEAD4MAPTALDH1A1POLBTDP1
SCHEMBL9973093 0.90 TEAD4 (0.73) TEAD4MAPTALDH1A1POLBTDP1
SCHEMBL15746112 0.90 TEAD4 (0.73) TEAD4MAPTALDH1A1POLBTDP1
SCHEMBL20211065 0.88 ESR1 (0.53) TEAD4MAPTALDH1A1POLBTDP1
SCHEMBL22078495 0.88 TEAD4 (0.44) TEAD4MAPTALDH1A1POLBTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 652 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240019738-A1 DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF JAPAN DISPLAY INC. (JP) 2024-01-18 US disclosed
US-20240019738-A1 DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF JAPAN DISPLAY INC. (JP) 2024-01-18 US disclosed
US-11814483-B2 Separation membrane comprising coating layer, method of preparing same, and battery using same SAMSUNG SDI CO., LTD. (KR) 2023-11-14 US disclosed
US-11814483-B2 Separation membrane comprising coating layer, method of preparing same, and battery using same SAMSUNG SDI CO., LTD. (KR) 2023-11-14 US disclosed
US-20230357505-A1 POLY(AMIDE-IMIDE) COPOLYMER, METHOD OF MANUFACTURING THE SAME, POLY(AMIDE-IMIDE) COPOLYMER FILM, WINDOW FOR DISPLAY DEVICE, AND DISPLAY DEVICE SAMSUNG ELECTRONICS CO LTD (KR) 2023-11-09 US disclosed
US-20230357505-A1 POLY(AMIDE-IMIDE) COPOLYMER, METHOD OF MANUFACTURING THE SAME, POLY(AMIDE-IMIDE) COPOLYMER FILM, WINDOW FOR DISPLAY DEVICE, AND DISPLAY DEVICE SAMSUNG ELECTRONICS CO LTD (KR) 2023-11-09 US disclosed
EP-4043419-B1 COMPOUND AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2023-10-18 EP disclosed
EP-3597694-B1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, AND BLACK MATRIX SHINETSU CHEMICAL CO (JP) 2023-10-11 EP disclosed
EP-3687963-B1 METHOD FOR SEPARATION OF LIGHT OLEFINS UOP LLC (US) 2023-09-06 EP disclosed
US-11739183-B2 Poly(amide-imide) copolymer, method of manufacturing the same, poly(amide-imide) copolymer film, window for display device, and display device SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-08-29 US disclosed
US-7256248-B2 Imide silicone resin and production process therefor SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-08-14 US disclosed
US-7256248-B2 Imide silicone resin and production process therefor SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-08-14 US disclosed
US-20070155948-A1 Multi-functional polyamic acids, and compositions and methods relating thereto E. I. DU PONT DE NEMOURS AND COMPANY 2007-07-05 US disclosed
US-20070155948-A1 Multi-functional polyamic acids, and compositions and methods relating thereto E. I. DU PONT DE NEMOURS AND COMPANY 2007-07-05 US disclosed
US-20070122743-A1 comprising supports having recording layer including multilayers containing water-insoluble and alkali-soluble resin containing infrared absorbers, development inhibitors that exhibiting enhanced solubility in an aqueous alkali solution through light exposure FUJI PHOTO FILM CO., LTD. 2007-05-31 US disclosed
US-20070122743-A1 comprising supports having recording layer including multilayers containing water-insoluble and alkali-soluble resin containing infrared absorbers, development inhibitors that exhibiting enhanced solubility in an aqueous alkali solution through light exposure FUJI PHOTO FILM CO., LTD. 2007-05-31 US disclosed
US-7163986-B2 Siloxane copolymer, making method, and thermosetting resin composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-01-16 US disclosed
US-7163986-B2 Siloxane copolymer, making method, and thermosetting resin composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-01-16 US disclosed
US-20070003773-A1 Multi-layer polyimide films and flexible circuit substrates therefrom DUPONT TORAY CO. LTD. (JP) 2007-01-04 US disclosed
US-20070003773-A1 Multi-layer polyimide films and flexible circuit substrates therefrom DUPONT TORAY CO. LTD. (JP) 2007-01-04 US disclosed