SCHEMBL820283

SCHEMBL820283

CC[SiH](C)[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Propane SCHEMBL27745448 0.74
SCHEMBL8381402 0.74
SCHEMBL4155549 0.70
SCHEMBL8386039 0.70
SCHEMBL8384102 0.70
SCHEMBL296998 0.67
SCHEMBL7574421 0.67
SCHEMBL313276 0.65
SCHEMBL8381557 0.65
SCHEMBL8381790 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119013227-A Process for producing compound 山中修科技股份有限公司 2024-11-22 CN disclosed
EP-2264095-B1 Additive package for thermoplastic condensation polymers CHEMOURS COMPANY TT LLC (US) 2016-08-10 EP disclosed
EP-1802697-B1 ADDITIVE PACKAGE FOR THERMOPLASTIC CONDENSATION POLYMERS DU PONT (US) 2011-07-20 EP disclosed
EP-2264095-A1 Additive package for thermoplastic condensation polymers E. I. du Pont de Nemours and Company (US) 2010-12-22 EP disclosed
US-7544387-B2 Additive package for thermoplastic condensation polymers THE CHEMOURS COMPANY FC, LLC 2009-06-09 US disclosed
WO-2009056154-A1 DIELECTRIC RESONATOR PIRELLI & C. S.P.A. (IT) 2009-05-07 WO disclosed
US-7338995-B2 Titanium dioxide—containing polymers and films with reduced melt fracture E.I. DU PONT DE NEMOURS AND COMPANY (US) 2008-03-04 US disclosed
US-20070299184-A1 Additive Package for Thermoplastic Condensation Polymers THE CHEMOURS COMPANY FC, LLC 2007-12-27 US disclosed
EP-1802697-A4 ADDITIVE PACKAGE FOR THERMOPLASTIC CONDENSATION POLYMERS DU PONT (US) 2007-10-24 EP disclosed
EP-1802697-A2 ADDITIVE PACKAGE FOR THERMOPLASTIC CONDENSATION POLYMERS E.I. DUPONT DE NEMOURS AND COMPANY (US) 2007-07-04 EP disclosed
US-5993690-A Organosilicon compound, liquid crystal composition, and liquid-crystal display element CHISSO CORPORATION (JP) 1999-11-30 US disclosed
EP-0959060-A1 CHLOROBENZENE DERIVATIVES, LIQUID-CRYSTAL COMPOSITION, AND LIQUID-CRYSTAL DISPLAY ELEMENTS CHISSO CORPORATION (JP) 1999-11-24 EP disclosed
EP-0630933-B1 A method of producing a semiconducting material NIPPON OIL CO LTD (JP) 1999-04-14 EP disclosed
EP-0872484-A1 ORGANOSILICON COMPOUNDS, LIQUID-CRYSTAL COMPOSITION, AND LIQUID-CRYSTAL DISPLAY ELEMENT CHISSO CORPORATION (JP) 1998-10-21 EP disclosed
US-5700400-A Method for producing a semiconducting material NIPPON OIL CO., LTD. (JP) 1997-12-23 US disclosed
EP-0551771-B1 Process for producing polysilanes NIPPON OIL CO LTD (JP) 1997-07-30 EP disclosed
US-5620531-A Photovoltaic element NIPPON OIL CO., LTD. (JP) 1997-04-15 US disclosed
EP-0717451-A2 Photovoltaic element NIPPON OIL CO., LTD. (JP) 1996-06-19 EP disclosed
EP-0630933-A2 A method of producing a semiconducting material NIPPON OIL CO. LTD. (JP) 1994-12-28 EP disclosed
US-5304622-A Process for producing polysilanes NIPPON OIL COMPANY, LTD. (JP) 1994-04-19 US disclosed