SCHEMBL822126

SCHEMBL822126

CCCCCCCCCCNC(=O)Nc1ccc(Cc2ccc(NC(=O)NCCCCCCCCCC)cc2)cc1

nearest known ligand 0.72

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 9/20 0.72
ALDH1A1 P00352 1/20 0.72
HTT P42858 1/20 0.72
S1PR1 P21453 1/20 0.64
LMNA P02545 1/20 0.63
MAPT P10636 1/20 0.63
HDAC1 Q13547 1/20 0.63
HDAC2 Q92769 1/20 0.63
GHSR Q92847 7/20 0.62
EPHX2 P34913 1/20 0.60
ADRB3 P13945 1/20 0.57

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17189466 1.00 EPHX1 (0.72) EPHX1ALDH1A1HTTS1PR1LMNA
SCHEMBL17189471 1.00 EPHX1 (0.72) EPHX1ALDH1A1HTTS1PR1LMNA
SCHEMBL468415 1.00 EPHX1 (0.72) EPHX1ALDH1A1HTTS1PR1LMNA
SCHEMBL15358666 1.00 EPHX1 (0.72) EPHX1ALDH1A1HTTS1PR1LMNA
SCHEMBL10599703 0.94 MAPT (0.67) EPHX1ALDH1A1HTTS1PR1LMNA
SCHEMBL4685909 0.93 EPHX1 (0.67) EPHX1ALDH1A1HTTS1PR1LMNA
SCHEMBL6438783 0.92 EPHX1 (0.84) EPHX1ALDH1A1HTTS1PR1LMNA
SCHEMBL11034317 0.92 EPHX1 (0.84) EPHX1ALDH1A1HTTS1PR1LMNA
SCHEMBL11033138 0.92 EPHX1 (0.84) EPHX1ALDH1A1HTTS1PR1LMNA
SCHEMBL21766543 0.92 EPHX1 (0.62) EPHX1ALDH1A1HTTS1PR1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10030138-B2 High thermal conductivity thermoplastic resin composition with excellent injection moldability KANEKA CORPORATION (JP) 2018-07-24 US disclosed
EP-2050790-B1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED BODY THEREOF KANEKA CORP (JP) 2018-06-13 EP disclosed
US-20160152823-A1 HIGH THERMAL CONDUCTIVITY THERMOPLASTIC RESIN COMPOSITION WITH EXCELLENT INJECTION MOLDABILITY KANEKA CORPORATION (JP) 2016-06-02 US disclosed
EP-3018172-A1 HIGH THERMAL CONDUCTIVITY THERMOPLASTIC RESIN COMPOSITION WITH EXCELLENT INJECTION MOLDABILITY Kaneka Corporation (JP) 2016-05-11 EP disclosed
EP-1881036-B1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED FROM THE SAME KANEKA CORP (JP) 2015-04-15 EP disclosed
US-20130202882-A1 HIGHLY THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE, AND MANUFACTURING METHOD FOR SAME KANEKA CORPORATION (JP) 2013-08-08 US disclosed
US-8394489-B2 Highly thermally conductive resin molded article KANEKA CORPORATION (JP) 2013-03-12 US disclosed
EP-1994798-A4 TRANSVERSE FLUX ELECTRIC INDUCTORS INDUCTOTHERM CORP (US) 2011-11-23 EP disclosed
US-8053491-B2 Biodegradable resin composition and molded article of the same KANEKA CORPORATION (JP) 2011-11-08 US disclosed
US-7973101-B2 Biodegradable resin composition and molded article produced from the same KANEKA CORPORATION (JP) 2011-07-05 US disclosed
US-7919549-B2 Biodegradable resin composition and molded article produced from the same KANEKA CORPORATION (JP) 2011-04-05 US disclosed
US-20110027565-A1 HIGHLY THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE KANEKA CORPORATION (JP) 2011-02-03 US disclosed
US-20100041791-A1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED ARTICLE OF THE SAME KANEKA CORPORATION (JP) 2010-02-18 US disclosed
US-20090111921-A1 Biodegradable Resin Composition and Molded Article Produced From The Same KANEKA CORPORATION (JP) 2009-04-30 US disclosed
EP-2050790-A1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED BODY THEREOF Kaneka Corporation (JP) 2009-04-22 EP disclosed
US-20090076191-A1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED FROM THE SAME KANEKA CORPORATION (JP) 2009-03-19 US disclosed
US-20080033077-A1 Biodegradable Resin Compositions and Molded Objects Thereof KANEKA CORPORATION (JP) 2008-02-07 US disclosed
EP-1881036-A1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED FROM THE SAME Kaneka Corporation (JP) 2008-01-23 EP disclosed
EP-1826241-A1 BIODEGRADABLE RESIN COMPOSITIONS AND MOLDED OBJECTS THEREOF Kaneka Corporation (JP) 2007-08-29 EP disclosed