⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14255997 | 1.00 | — | — | |
| SCHEMBL14256037 | 0.79 | — | — | |
| SCHEMBL25330313 | 0.75 | TSHR (0.44) | — | |
| SCHEMBL14616139 | 0.75 | — | — | |
| SCHEMBL14256229 | 0.75 | — | — | |
| SCHEMBL26703946 | 0.75 | CNR1 (0.30) | — | |
| SCHEMBL20985488 | 0.75 | ALDH1A1 (0.32) | — | |
| SCHEMBL15368848 | 0.74 | — | — | |
| SCHEMBL16693628 | 0.74 | — | — | |
| SCHEMBL11946722 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230234905-A1 | NOVEL TRISPHENOL DERIVATIVE | HONSHU CHEMICAL INDUSTRY CO., LTD. (JP) | 2023-07-27 | — | — | US | disclosed |
| US-9765012-B2 | Method for producing diaryl carbonate | COVESTRO DEUTSCHLAND AG (DE) | 2017-09-19 | — | — | US | disclosed |
| EP-3205685-A1 | COPOLYCARBONATE AND COMPOSITION COMPRISING SAME | LG Chem, Ltd. (KR) | 2017-08-16 | — | — | EP | disclosed |
| US-20170073300-A1 | METHOD FOR PRODUCING DIARYL CARBONATES | COVESTRO DEUTSCHLAND AG (DE) | 2017-03-16 | — | — | US | disclosed |
| US-8372176-B2 | Metal complexes comprising a ligand derived from 2-aryl-2-hydroxyacetic acid and a divalent or trivalent metal cation, and their use | CLARIANT SPECIALTY FINE CHEMICALS (FRANCE) (FR) | 2013-02-12 | — | — | US | disclosed |
| US-20120305295-A1 | THERMOSETTING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-12-06 | — | — | US | disclosed |
| US-20120228782-A1 | METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE AND ELECTRONIC DEVICE PACKAGE | Sumitomo Bakelite Co, Ltd (JP) | 2012-09-13 | — | — | US | disclosed |
| US-20120168894-A1 | HARD MASK COMPOSITION, METHOD OF FORMING A PATTERN, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING THE PATTERN | CHEIL INDUSTRIES, INC. (KR) | 2012-07-05 | — | — | US | disclosed |
| US-20110272183-A1 | (POLY)CARBONATE POLYOL AND CARBOXYL GROUP-CONTAINING POLYURETHANE OBTAINED FROM THE (POLY)CARBONATE POLYOL | SHOWA DENKO K.K. (JP) | 2011-11-10 | — | — | US | disclosed |
| US-20110253426-A1 | CURABLE COMPOSITION | SHOWA DENKO K.K. (JP) | 2011-10-20 | — | — | US | disclosed |
| US-7674859-B2 | Adhesive composition and adhesive sheet | LINTEC CORPORATION (JP) | 2010-03-09 | — | — | US | disclosed |
| US-20100032826-A1 | SEMICONDUCTOR PACKAGE, CORE LAYER MATERIAL, BUILDUP LAYER MATERIAL, AND SEALING RESIN COMPOSITION | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2010-02-11 | — | — | US | disclosed |
| US-20100016497-A1 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | MIZUNO YASUHIRO | 2010-01-21 | — | — | US | disclosed |
| US-20090004829-A1 | Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device | LINTEC CORPORATION (JP) | 2009-01-01 | — | — | US | disclosed |
| US-7442729-B2 | curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. | SUMITOMO BAEKLITE COMPANY LIMITED (JP) | 2008-10-28 | — | — | US | disclosed |
| US-20080185700-A1 | Adhesive Film and Method for Manufacturing Semiconductor Device Using Same | MITSUI CHEMICALS, INC. (JP) | 2008-08-07 | — | — | US | disclosed |
| US-7397139-B2 | Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more | HITACHI CHEMICAL CO., LTD. (JP) | 2008-07-08 | — | — | US | disclosed |
| US-7381501-B2 | Polymer electrolyte and proton conductive membrane | JSR CORPORATION (JP) | 2008-06-03 | — | — | US | disclosed |
| US-20070031675-A1 | Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the same | CHEIL INDUSTRIES, INC. (KR) | 2007-02-08 | — | — | US | disclosed |
| US-20070010601-A1 | Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device | SUMOTOMO BAKELITE COMPANY LIMITED (JP) | 2007-01-11 | — | — | US | disclosed |