Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HIF1A | Q16665 | 2/20 | 0.55 |
| ▸ | HTT | P42858 | 1/20 | 0.55 |
| ▸ | AR | P10275 | 3/20 | 0.54 |
| ▸ | ESR1 | P03372 | 3/20 | 0.53 |
| ▸ | ESR2 | Q92731 | 3/20 | 0.53 |
| ▸ | HPGD | P15428 | 3/20 | 0.53 |
| ▸ | TSHR | P16473 | 3/20 | 0.53 |
| ▸ | SLC6A2 | P23975 | 2/20 | 0.53 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.53 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.53 |
| ▸ | HTR6 | P50406 | 1/20 | 0.53 |
| ▸ | ESRRG | P62508 | 1/20 | 0.53 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.53 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.53 |
| ▸ | LMNA | P02545 | 1/20 | 0.53 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.46 |
| ▸ | ADRB3 | P13945 | 3/20 | 0.44 |
| ▸ | ADRB2 | P07550 | 2/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13892365 | 1.00 | HIF1A (0.55) | HIF1AHTTARESR1ESR2 | |
| SCHEMBL376300 | 0.93 | HIF1A (0.61) | HIF1AHTTARHPGDTSHR | |
| SCHEMBL8462018 | 0.93 | HIF1A (0.49) | HIF1AHTTARESR1ESR2 | |
| SCHEMBL22481815 | 0.90 | HIF1A (0.49) | HIF1AHTTARESR1ESR2 | |
| SCHEMBL17702714 | 0.88 | HIF1A (0.56) | HIF1AHTTARHPGDTSHR | |
| SCHEMBL13851882 | 0.88 | HTT (0.65) | HIF1AHTTARHPGDTSHR | |
| SCHEMBL24119613 | 0.88 | HPGD (0.55) | HIF1AHTTARESR1ESR2 | |
| SCHEMBL13567688 | 0.88 | HTT (0.65) | HIF1AHTTARESR1ESR2 | |
| SCHEMBL16553424 | 0.88 | HIF1A (0.56) | HIF1AHTTARESR1ESR2 | |
| SCHEMBL10922516 | 0.88 | LMNA (0.67) | HIF1ASLC6A2SLC6A4SLC6A3LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 215 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101528797-B | Derivatized solid epoxy resins and uses thereof | SIKA TECHNOLOGY AG | 2013-04-24 | — | — | CN | claimed |
| CN-101528797-A | Derivatized solid epoxy resins and uses thereof | SIKA TECHNOLOGY AG (CH) | 2009-09-09 | — | — | CN | claimed |
| US-20030008088-A1 | Dielectric exterior overcoating containing epoxy resin | NOK CORPORATION (JP) | 2003-01-09 | — | — | US | claimed |
| WO-2023106478-A1 | DRY ELECTRODE, AND PRODUCTION METHOD FOR SAME | 한국재료연구원 | 2023-06-15 | — | — | WO | disclosed |
| CN-113728040-B | Polyester resin composition | 日清纺化学株式会社 | 2023-05-16 | — | — | CN | disclosed |
| EP-2980058-B1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-03 | — | — | EP | disclosed |
| EP-3153535-B1 | POLYURETHANE-MODIFIED EPOXY RESIN, METHOD FOR PRODUCING SAME, EPOXY RESIN COMPOSITION AND CURED PRODUCT | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2022-12-21 | — | — | EP | disclosed |
| US-11306178-B2 | Epoxy resin composition and cured product | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2022-04-19 | — | — | US | disclosed |
| US-20210395604-A1 | METHODS FOR MAKING PROPPANT COATINGS | SAUDI ARABIAN OIL COMPANY (SA) | 2021-12-23 | — | — | US | disclosed |
| CN-113728040-A | Polyester resin composition | 日清纺化学株式会社 | 2021-11-30 | — | — | CN | disclosed |
| US-20210230421-A1 | TOUGHENED EPOXY COMPOSITIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2021-07-29 | — | — | US | disclosed |
| US-20070104973-A1 | Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same | SONY CHEMICALS CORPORATION (JP) | 2007-05-10 | — | — | US | disclosed |
| US-7195858-B2 | Negative type photosensitive resin composition containing a phenol-biphenylene resin | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2007-03-27 | — | — | US | disclosed |
| US-20070060663-A1 | Photocurable composition, photocurable ink composition, printing method and resist composition using the same | KONICA MINOLTA MEDICAL & GRAPHIC, INC. | 2007-03-15 | — | — | US | disclosed |
| US-20070026226-A1 | Epoxy primer layer for fuser belts | EASTMAN KODAK COMPANY | 2007-02-01 | — | — | US | disclosed |
| US-20070026225-A1 | Primer composition for high temperature belts | EASTMAN KODAK COMPANY | 2007-02-01 | — | — | US | disclosed |
| US-20070020307-A1 | Medical devices containing radiation resistant polymers | BOSTON SCIENTIFIC SCIMED, INC. | 2007-01-25 | — | — | US | disclosed |
| US-7160486-B2 | Material based on vinylester resin for neutron shielding and maintenance of sub-criticality | COGEMA LOGISTICS (FR) | 2007-01-09 | — | — | US | disclosed |
| US-20030008088-A1 | Dielectric exterior overcoating containing epoxy resin | NOK CORPORATION (JP) | 2003-01-09 | — | — | US | disclosed |
| WO-2002017413-A1 | CASE FOR ELECTRONIC PARTS | NOK CORPORATION (JP) | 2002-02-28 | — | — | WO | disclosed |