⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Thiosulfuric Acid SCHEMBL9501847 | 1.00 | CA5A (0.46) | — | |
| Thiosulfuric Acid SCHEMBL3697395 | 1.00 | — | — | |
| Thiosulfuric Acid SCHEMBL28476702 | 0.95 | — | — | |
| Thiosulfuric Acid SCHEMBL3422841 | 0.95 | CA5A (0.50) | — | |
| Thiosulfuric Acid SCHEMBL8512498 | 0.95 | CA5A (0.50) | — | |
| Thiosulfuric Acid SCHEMBL5145687 | 0.95 | CA5A (0.50) | — | |
| Thiosulfuric Acid SCHEMBL16761679 | 0.95 | — | — | |
| Thiosulfuric Acid SCHEMBL6446 | 0.95 | — | — | |
| Thiosulfuric Acid SCHEMBL11785568 | 0.95 | CA5A (0.50) | — | |
| Thiosulfuric Acid SCHEMBL924453 | 0.95 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3186413-B1 | COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS | ATOTECH DEUTSCHLAND GMBH (DE) | 2019-02-06 | — | — | EP | disclosed |
| EP-3023520-B1 | ENVIRONMENTALLY FRIENDLY GOLD ELECTROPLATING COMPOSITIONS AND CORRESPONDING METHOD | ROHM & HAAS ELECT MAT (US) | 2019-01-30 | — | — | EP | disclosed |
| EP-1306466-B1 | Electroless gold plating composition | ROHM & HAAS ELECT MAT (US) | 2018-11-21 | — | — | EP | disclosed |
| EP-2634293-B1 | COMPOSITES OF CARBON BLACK AND METAL | ROHM & HAAS ELECT MAT (US) | 2018-07-18 | — | — | EP | disclosed |
| EP-3186413-A1 | COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS | ATOTECH Deutschland GmbH (DE) | 2017-07-05 | — | — | EP | disclosed |
| US-20170159195-A1 | COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS | ATOTECH DEUTSCHLAND GMBH (DE) | 2017-06-08 | — | — | US | disclosed |
| EP-1728898-B1 | Electrolytes for the deposition of gold alloys | ROHM & HAAS ELECT MAT (US) | 2017-02-22 | — | — | EP | disclosed |
| US-20160145756-A1 | ENVIRONMENTALLY FRIENDLY GOLD ELECTROPLATING COMPOSITIONS AND METHODS | ROHM AND HAAS ELECRONIC MATERIALS LLC | 2016-05-26 | — | — | US | disclosed |
| US-20160145745-A1 | FORMALDEHYDE-FREE ELECTROLESS METAL PLATING COMPOSITIONS AND METHODS | ROHM AND HAAS ELECRONIC MATERIALS LLC | 2016-05-26 | — | — | US | disclosed |
| EP-3023515-A2 | FORMALDEHYDE-FREE ELECTROLESS METAL PLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2016-05-25 | — | — | EP | disclosed |
| US-20090104463-A1 | Gold alloy electrolytes | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2009-04-23 | — | — | US | disclosed |
| US-7465385-B2 | Gold alloy electrolytes | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-12-16 | — | — | US | disclosed |
| US-20060283714-A1 | Gold alloy electrolytes | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2006-12-21 | — | — | US | disclosed |
| EP-1728898-A2 | Electrolytes for the deposition of gold alloys | Rohm and Haas Electronic Materials LLC (US) | 2006-12-06 | — | — | EP | disclosed |
| US-6911230-B2 | Plating method | SHIPLEY COMPANY, L.L.C. (US) | 2005-06-28 | — | — | US | disclosed |
| US-6776828-B2 | ELECTROLESS GOLD PLATING COMPOSITION COMPRISING ONE OR MORE WATER SOLUBLE GOLD COMPOUNDS, ONE OR MORE GOLD COMPLEXING AGENTS, ONE OR MORE ORGANIC STABILIZER COMPOUNDS, AND ONE OR MORE UNIFORMITY ENHANCERS | SHIPLEY COMPANY, L.L.C. | 2004-08-17 | — | — | US | disclosed |
| US-20040018308-A1 | Plating method | SHIPLEY COMPANY, L.L.C. | 2004-01-29 | — | — | US | disclosed |
| US-20040009292-A1 | Including one or more water soluble gold compounds, gold complexing agents, organic stabilizer compounds, and carboxylic acid uniformity enhancers; for printed wiring board substrates, integrated circuits, lead frames, pads | SHIPLEY COMPANY, L.L.C. (US) | 2004-01-15 | — | — | US | disclosed |
| EP-1319734-A1 | Plating method | Shipley Co. L.L.C. (US) | 2003-06-18 | — | — | EP | disclosed |
| EP-1306466-A2 | Electroless gold plating composition | Shipley Co. L.L.C. (US) | 2003-05-02 | — | — | EP | disclosed |