Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 5/20 | 0.62 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.62 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.62 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.56 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.56 |
| ▸ | TP53 | P04637 | 1/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.55 |
| ▸ | LMNA | P02545 | 2/20 | 0.54 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.54 |
| ▸ | ESR1 | P03372 | 6/20 | 0.53 |
| ▸ | MEN1 | O00255 | 1/20 | 0.52 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.52 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.50 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.50 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.50 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.50 |
| ▸ | RNASEL | Q05823 | 1/20 | 0.50 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL828395 | 1.00 | TSHR (0.62) | TSHRTDP1L3MBTL1MAPK1CYP3A4 | |
| SCHEMBL17713234 | 1.00 | TSHR (0.62) | TSHRTDP1L3MBTL1MAPK1CYP3A4 | |
| SCHEMBL11575455 | 1.00 | TSHR (0.62) | TSHRTDP1L3MBTL1MAPK1CYP3A4 | |
| Hydrochloric Acid SCHEMBL6927779 | 0.98 | TSHR (0.61) | TSHRTDP1L3MBTL1MAPK1CYP3A4 | |
| SCHEMBL30871905 | 0.95 | TSHR (0.64) | TSHRTDP1L3MBTL1MAPK1CYP3A4 | |
| SCHEMBL828233 | 0.93 | TSHR (0.65) | TSHRTDP1L3MBTL1MAPK1CYP3A4 | |
| SCHEMBL4820297 | 0.93 | TSHR (0.65) | TSHRTDP1L3MBTL1MAPK1CYP3A4 | |
| SCHEMBL829547 | 0.93 | TSHR (0.65) | TSHRTDP1L3MBTL1MAPK1CYP3A4 | |
| SCHEMBL828828 | 0.93 | TSHR (0.65) | TSHRTDP1L3MBTL1MAPK1CYP3A4 | |
| SCHEMBL828955 | 0.93 | TSHR (0.65) | TSHRTDP1L3MBTL1MAPK1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1567470-B1 | HYDROGENATION OF BENZENE POLYCARBOXYLIC ACIDS OR DERIVATIVES THEREOF | EXXONMOBIL CHEM PATENTS INC (US) | 2013-06-05 | — | — | EP | claimed |
| US-7595420-B2 | Hydrogenation of benzene polycarboxylic acids or derivatives thereof | EXXONMOBIL CHEMICAL PATENTS INC. (US) | 2009-09-29 | — | — | US | claimed |
| US-20060247461-A1 | Hydrogenation of benzene polycarboxylic acids or derivatives thereof | EXXONMOBIL CHEMICAL PATENTS INC. | 2006-11-02 | — | — | US | claimed |
| EP-3144338-B1 | VARNISH INCLUDING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER, IMIDE RESIN COMPOSITION HAVING EXCELLENT MOLDABILITY, CURED RESIN MOLDED ARTICLE HAVING EXCELLENT BREAKING ELONGATION, PREPREG THEREOF, IMIDE PREPREG THEREOF, AND FIBER-REINFORCED MATERIAL THEREOF HAVING HIGH HEAT RESISTANCE AND EXCELLENT MECHANICAL STRENGTH | KANEKA CORP (JP) | 2023-10-25 | — | — | EP | disclosed |
| WO-2019226641-A9 | VARNISH OF POLYIMIDE HAVING HIGH HEAT RESISTANCE AND EXCELLENT MECHANICAL STRENGTH | KANEKA AMERICAS HOLDING, INC. (US) | 2020-01-23 | — | — | WO | disclosed |
| US-10017448-B2 | Process for hydrogenation of benzenepolycarboxylic acids and derivatives thereof | EXXONMOBIL CHEMICAL PATENTS INC. (US) | 2018-07-10 | — | — | US | disclosed |
| US-20170291867-A1 | Improved Process for Hydrogenation of Benzenepolycarboxylic Acids and Derivatives Thereof | EXXONMOBIL CHEMICAL PATENTS INC. | 2017-10-12 | — | — | US | disclosed |
| US-20170152399-A1 | VARNISH INCLUDING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER, IMIDE RESIN COMPOSITION HAVING EXCELLENT MOLDABILITY, CURED RESIN MOLDED ARTICLE HAVING EXCELLENT BREAKING ELONGATION, PREPREG THEREOF, IMIDE PREPREG THEREOF, AND FIBER-REINFORCED MATERIAL THEREOF HAVING HIGH HEAT RESISTANCE AND EXCELLENT MECHANICAL STRENGTH | KANEKA CORPORATION (JP) | 2017-06-01 | — | — | US | disclosed |
| EP-3144338-A1 | VARNISH USING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER, IMIDE RESIN COMPOSITION EXHIBITING EXCELLENT MOLDABILITY, CURED RESIN MOLDED ARTICLE HAVING EXCELLENT BREAKING ELONGATION, PREPREG USING SAME, IMIDE PREPREG, AND FIBER-REINFORCED MATERIAL EXHIBITING EXCELLENT HEAT RESISTANCE AND MECHANICAL STRENGTH | Kaneka Corporation (JP) | 2017-03-22 | — | — | EP | disclosed |
| EP-1567470-B1 | HYDROGENATION OF BENZENE POLYCARBOXYLIC ACIDS OR DERIVATIVES THEREOF | EXXONMOBIL CHEM PATENTS INC (US) | 2013-06-05 | — | — | EP | disclosed |
| US-8203017-B2 | Hydrogenation of benzene polycarboxylic acids or derivatives thereof | EXXONMOBIL CHEMICAL PATENTS INC. (US) | 2012-06-19 | — | — | US | disclosed |
| WO-2004046076-A2 | HYDROGENATION CATALYST, PREPARATION THEREOF AND HYDROGENATION PROCESSES USING THIS CATALYST | EXXONMOBIL RESEARCH AND ENGINEERING COMPANY (US) | 2004-06-03 | — | — | WO | disclosed |
| EP-0997777-B1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | HITACHI CHEM DUPONT MICROSYS (JP) | 2003-06-04 | — | — | EP | disclosed |
| US-6514658-B2 | Polyimide or precursor thereof soluble in alkaline solution, a photosensitive acid generator, and a compound having a phenolic hydroxyl group; positive-type, heat resistance | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-20020019559-A1 | Hydrogenation of benzenepolycarboxylic acids or derivatives thereof using a catalyst containing macropores | BRUNNER MELANIE (DE) | 2002-02-14 | — | — | US | disclosed |
| US-6329110-B1 | POSITIVES, POLYIMIDE SOLUBLE IN AN AQUEOUS ALKALINE SOLUTION; QUINONEDIAZIDE CAPABLE OF GENERATING AN ACID WHEN EXPOSED TO LIGHT; COMPOUND HAVING A PHENOLIC HYDROXYL GROUP; | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2001-12-11 | — | — | US | disclosed |
| US-20010031419-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | NUNOMURA MASATAKA (JP) | 2001-10-18 | — | — | US | disclosed |
| US-6284917-B1 | Method for hydrogenating benzene polycarboxylic acids or derivatives thereof by using a catalyst containing macropores | BASF AKTIENGESELLSCHAFT (DE) | 2001-09-04 | — | — | US | disclosed |
| EP-0997777-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2000-05-03 | — | — | EP | disclosed |
| EP-0863436-A1 | Heat resistant photosensitive polymer composition, process for forming pattern and semiconductor device | HITACHI CHEMICAL CO., LTD. (JP) | 1998-09-09 | — | — | EP | disclosed |