SCHEMBL830550

SCHEMBL830550

COC(CCC=C(C)C(=O)O)(OC)OC

nearest known ligand 0.36

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CD81 P60033 2/20 0.35
PPARG P37231 1/20 0.31
KDM4E B2RXH2 1/20 0.31
ATM Q13315 1/20 0.31
BACE1 P56817 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1593663 0.90 CD81 (0.34) CD81PPARG
SCHEMBL1623797 0.82 CD81 (0.35) CD81PPARG
SCHEMBL18600562 0.79 GRIK1 (0.31)
SCHEMBL10983434 0.79 CD81 (0.33) CD81PPARG
SCHEMBL16161319 0.79 CYP2D6 (0.31)
SCHEMBL8108634 0.79 APEX1 (0.31) CD81
SCHEMBL2438948 0.77 ALDH1A1 (0.37) CD81PPARG
SCHEMBL3622962 0.77 CD81 (0.39) CD81PPARGBACE1
SCHEMBL1243141 0.76 CD81 (0.33) CD81
SCHEMBL15872123 0.76 CD81 (0.33) CD81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20060229406-A1 Process for uniformly dispersing particles in a polymer E. I. DU PONT DE NEMOURS AND COMPANY 2006-10-12 US claimed
US-10007203-B2 Complex particle, external additive for toner and method of preparing complex particle SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-06-26 US disclosed
US-20160223928-A1 COMPLEX PARTICLE, EXTERNAL ADDITIVE FOR TONER AND METHOD OF PREPARING COMPLEX PARTICLE SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-08-04 US disclosed
US-8142888-B2 Integrated molded product of a polybutylene terephthalate resin composition having silicone rubber excellently adhered thereto which concomitantly displays superior heat shock resistance WINTECH POLYMER LTD. (JP) 2012-03-27 US disclosed
US-20060229406-A1 Process for uniformly dispersing particles in a polymer E. I. DU PONT DE NEMOURS AND COMPANY 2006-10-12 US disclosed
WO-2006102669-A1 PROCESS FOR UNIFORMLY DISPERSING PARTICLES IN A POLYMER E. I. DU PONT DE NEMOURS AND COMPANY (US) 2006-09-28 WO disclosed
EP-1357145-B1 Transparent resin laminate and molded article incorporating the same MITSUBISHI GAS CHEMICAL CO (JP) 2006-05-10 EP disclosed
EP-1120245-B1 Infrared-sensitive image forming material FUJI PHOTO FILM CO LTD (JP) 2005-11-09 EP disclosed
EP-0774687-B1 Solid processing composition and method for processing silver halide photographic light-sensitive material KONISHIROKU PHOTO IND (JP) 2004-09-15 EP disclosed
US-6727031-B2 SUPPORT AND A RECORDING LAYER WHOSE SOLUBILITY IS ALTERED BY IRRADIATION WITH INFRARED LASER; USED FOR PRINTING PLATES, COLOR FILTERS, PHOTORESISTS FUJI PHOTO FILM CO., LTD. (JP) 2004-04-27 US disclosed
EP-1357145-A1 Transparent resin laminate and molded article incorporating the same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2003-10-29 EP disclosed
EP-0777150-B1 Developing composition for silver halide photographic light sensitive material KONISHIROKU PHOTO IND (JP) 2003-09-17 EP disclosed
US-20010026900-A1 Support and a recording layer whose solubility is altered by irradiation with infrared laser; used for printing plates, color filters, photoresists FUJIFILM CORPORATION (JP) 2001-10-04 US disclosed
EP-1120245-A2 Infrared-sensitive image forming material FUJI PHOTO FILM CO., LTD. (JP) 2001-08-01 EP disclosed
US-5851742-A Solid processing composition and method for processing silver halide photographic light-sensitive material KONICA CORPORATION (JP) 1998-12-22 US disclosed
US-5804358-A Developing composition for silver halide photographic light sensitive material KONICA CORPORATION (JP) 1998-09-08 US disclosed
EP-0777150-A1 Developing composition for silver halide photographic light sensitive material KONICA CORPORATION (JP) 1997-06-04 EP disclosed
EP-0774687-A1 Solid processing composition and method for processing silver halide photographic light-sensitive material KONICA CORPORATION (JP) 1997-05-21 EP disclosed