⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2841913 | 0.67 | — | — | |
| SCHEMBL1454565 | 0.67 | — | — | |
| SCHEMBL7728053 | 0.65 | — | — | |
| SCHEMBL3320964 | 0.62 | — | — | |
| SCHEMBL16289052 | 0.61 | — | — | |
| SCHEMBL16289053 | 0.61 | — | — | |
| SCHEMBL303922 | 0.60 | — | — | |
| SCHEMBL5114 | 0.60 | — | — | |
| SCHEMBL1452723 | 0.58 | — | — | |
| SCHEMBL3322648 | 0.57 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108368069-B | Oxazine compound, composition and cured product | DIC株式会社 | 2022-10-14 | — | — | CN | disclosed |
| US-11117873-B2 | Oxazine compound, composition, and cured product | DIC CORPORATION (JP) | 2021-09-14 | — | — | US | disclosed |
| US-11117872-B2 | Oxazine compound, composition and cured product | DIC CORPORATION (JP) | 2021-09-14 | — | — | US | disclosed |
| US-11028059-B2 | Oxazine compound, composition and cured product | DIC CORPORATION (JP) | 2021-06-08 | — | — | US | disclosed |
| CN-108368217-B | Oxazine compound, composition and cured product | DIC株式会社 | 2021-05-07 | — | — | CN | disclosed |
| CN-108473642-B | Oxazine compound, composition and cured product | DIC株式会社 | 2021-05-07 | — | — | CN | disclosed |
| US-10913725-B2 | Oxazine compound, composition and cured product | DIC CORPORATION (JP) | 2021-02-09 | — | — | US | disclosed |
| CN-108368218-B | Oxazine compound, composition and cured product | DIC株式会社 | 2020-11-06 | — | — | CN | disclosed |
| CN-108368216-B | Oxazine compound, composition and cured product | DIC株式会社 | 2020-09-18 | — | — | CN | disclosed |
| EP-3156450-B1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILDUP FILM, BUILDUP BOARD, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED ARTICLE | DAINIPPON INK & CHEMICALS (JP) | 2019-10-09 | — | — | EP | disclosed |
| US-20180362478-A1 | OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT | DIC CORPORATION (JP) | 2018-12-20 | — | — | US | disclosed |
| US-20180333941-A1 | OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT | DIC CORPORATION (JP) | 2018-11-22 | — | — | US | disclosed |
| EP-3401311-A1 | OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT | DIC Corporation (JP) | 2018-11-14 | — | — | EP | disclosed |
| EP-3392281-A1 | OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT | DIC Corporation (JP) | 2018-10-24 | — | — | EP | disclosed |
| EP-3388461-A1 | OXAZINE COMPOUND, COMPOSITION, AND CURED PRODUCT | DIC Corporation (JP) | 2018-10-17 | — | — | EP | disclosed |
| EP-3388460-A1 | OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT | DIC Corporation (JP) | 2018-10-17 | — | — | EP | disclosed |
| EP-3388459-A1 | OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT | DIC Corporation (JP) | 2018-10-17 | — | — | EP | disclosed |
| EP-3156450-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILDUP FILM, BUILDUP BOARD, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED ARTICLE | DIC Corporation (JP) | 2017-04-19 | — | — | EP | disclosed |
| US-20170101532-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR ENCAPSULATING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, BUILD-UP SUBSTRATE, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED PRODUCT | DIC CORPORATION (JP) | 2017-04-13 | — | — | US | disclosed |
| WO-1999004895-A1 | COMPOSITIONS FOR THE STORAGE AND DELIVERY OF SOLID PHASE REACTIVE PARTICLES AND METHODS OF USING THE SAME | ARGONAUT TECHNOLOGIES, INC. (US) | 1999-02-04 | — | — | WO | disclosed |