SCHEMBL833888

SCHEMBL833888

O=S(=O)(OO)OO[Hf]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8603752 0.73
SCHEMBL296318 0.71
SCHEMBL10515343 0.69 CA2 (0.62)
SCHEMBL15387346 0.69
Fluoride SCHEMBL7192638 0.68
SCHEMBL11871457 0.68 CA2 (0.31)
SCHEMBL11875297 0.68 CA2 (0.31)
SCHEMBL4814111 0.68
SCHEMBL1699694 0.67 CA2 (0.59)
SCHEMBL18300850 0.67 CA2 (0.59)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120176016-A1 CORE-SHELL PARTICULATES, ARTICLES, AND METHOD OF MAKING GENERAL ELECTRIC COMPANY (US) 2012-07-12 US disclosed
US-8143128-B2 Multilayer dielectric defect method HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2012-03-27 US disclosed
US-20100279514-A1 MULTILAYER DIELECTRIC HEWLETT-PACKARD DEVELOPMENT COMPANY LP 2010-11-04 US disclosed
US-7768080-B2 Multilayer dielectric HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2010-08-03 US disclosed
WO-2009042380-A1 CORE-SHELL PARTICULATES, ARTICLES, AND METHOD OF MAKING GENERAL ELECTRIC COMPANY (US) 2009-04-02 WO disclosed
US-20090032890-A1 MULTILAYER DIELECTRIC HEWLETT-PACKARD DEVELOPMENT 2009-02-05 US disclosed
EP-1810339-A1 METHOD OF FORMING A SOLUTION PROCESSED TRANSISTOR HAVING A MULTILAYER DIELECTRIC Hewlett-Packard Development Company, L.P. (US) 2007-07-25 EP disclosed
WO-2006047023-A1 METHOD OF FORMING A SOLUTION PROCESSED TRANSISTOR HAVING A MULTILAYER DIELECTRIC HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2006-05-04 WO disclosed
US-20060088962-A1 Method of forming a solution processed transistor having a multilayer dielectric HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 2006-04-27 US disclosed