Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GNAO1 | P09471 | 6/20 | 0.56 |
| ▸ | GNAI3 | P08754 | 5/20 | 0.56 |
| ▸ | GNAI1 | P63096 | 5/20 | 0.56 |
| ▸ | EBP | Q15125 | 1/20 | 0.53 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.53 |
| ▸ | BCHE | P06276 | 1/20 | 0.49 |
| ▸ | GUSB | P08236 | 2/20 | 0.48 |
| ▸ | HTR1A | P08908 | 5/20 | 0.47 |
| ▸ | DRD2 | P14416 | 5/20 | 0.47 |
| ▸ | DRD1 | P21728 | 5/20 | 0.47 |
| ▸ | DRD4 | P21917 | 5/20 | 0.47 |
| ▸ | DRD5 | P21918 | 5/20 | 0.47 |
| ▸ | DRD3 | P35462 | 5/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15363082 | 1.00 | GNAO1 (0.56) | GNAO1GNAI3GNAI1EBPSIGMAR1 | |
| SCHEMBL1071607 | 1.00 | GNAO1 (0.56) | GNAO1GNAI3GNAI1EBPSIGMAR1 | |
| SCHEMBL30375253 | 1.00 | GNAO1 (0.56) | GNAO1GNAI3GNAI1EBPSIGMAR1 | |
| Hydrochloric Acid SCHEMBL23004147 | 0.98 | GNAO1 (0.59) | GNAO1GNAI3GNAI1EBPSIGMAR1 | |
| Hydrochloric Acid SCHEMBL23004447 | 0.98 | GNAO1 (0.59) | GNAO1GNAI3GNAI1EBPSIGMAR1 | |
| Hydrochloric Acid SCHEMBL23004272 | 0.98 | GNAO1 (0.59) | GNAO1GNAI3GNAI1EBPSIGMAR1 | |
| Iodide SCHEMBL23004334 | 0.98 | GNAO1 (0.55) | GNAO1GNAI3GNAI1EBPSIGMAR1 | |
| Bromide SCHEMBL23004302 | 0.98 | GNAO1 (0.55) | GNAO1GNAI3GNAI1EBPSIGMAR1 | |
| Iodide SCHEMBL23004307 | 0.98 | GNAO1 (0.55) | GNAO1GNAI3GNAI1EBPSIGMAR1 | |
| Bromide SCHEMBL23004183 | 0.98 | GNAO1 (0.55) | GNAO1GNAI3GNAI1EBPSIGMAR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025261923-A1 | POLYURETHANE-BASED ADHESIVE WITH SWITCHABLE DEBONDING | HENKEL AG & CO. KGAA (DE) | 2025-12-26 | — | — | WO | disclosed |
| CN-118849536-A | Electrically debonding polyurethane hot melt adhesives by employing conductive inks | 汉高股份有限及两合公司 | 2024-10-29 | — | — | CN | disclosed |
| EP-3983078-B1 | NEXT-GENERATION MODULATORS OF STIMULATOR OF INTERFERON GENES (STING) | RYVU THERAPEUTICS S A (PL) | 2023-11-15 | — | — | EP | disclosed |
| EP-4105203-A1 | SPIRO-CONDENSED INDOLE COMPOUNDS AS EHMT2 INHIBITORS | Epizyme Inc (US) | 2022-12-21 | — | — | EP | disclosed |
| EP-3519393-B1 | SUBSTITUTED FUSED BI- OR TRI- HETEROCYCLIC COMPOUNDS AS EHMT2 INHIBITORS | EPIZYME INC (US) | 2022-05-18 | — | — | EP | disclosed |
| EP-3199344-B1 | ELECTRICAL DEBONDING OF PU HOT MELT ADHESIVES BY USE OF CONDUCTIVE INKS | HENKEL AG & CO KGAA (DE) | 2022-04-13 | — | — | EP | disclosed |
| WO-2020249773-A1 | NEXT-GENERATION MODULATORS OF STIMULATOR OF INTERFERON GENES (STING) | Ryvu Therapeutics S.A. (PL) | 2020-12-17 | — | — | WO | disclosed |
| CN-107207938-B | Debondable reactive hot melt adhesive | 汉高股份有限及两合公司 | 2020-12-15 | — | — | CN | disclosed |
| US-10800956-B2 | Debondable reactive hot melt adhesives | HENKEL AG & CO. KGAA (DE) | 2020-10-13 | — | — | US | disclosed |
| US-10590310-B2 | Electrical debonding of PU hot melt adhesives by use of conductive inks | HENKEL AG & CO. KGAA (DE) | 2020-03-17 | — | — | US | disclosed |
| US-20170355892-A1 | Debondable Reactive Hot Melt Adhesives | HENKEL AG & CO. KGAA (DE) | 2017-12-14 | — | — | US | disclosed |
| CN-107207938-A | Can unsticking reactive hot melt adhesive | 汉高股份有限及两合公司 | 2017-09-26 | — | — | CN | disclosed |
| WO-2017133864-A1 | ELECTRICAL DEBONDING OF PU HOT MELT ADHESIVES BY USE OF CONDUCTIVE INKS | HENKEL AG & CO. KGAA (DE) | 2017-08-10 | — | — | WO | disclosed |
| EP-3199344-A1 | ELECTRICAL DEBONDING OF PU HOT MELT ADHESIVES BY USE OF CONDUCTIVE INKS | Henkel AG & Co. KGaA (DE) | 2017-08-02 | — | — | EP | disclosed |
| WO-2016135341-A1 | DEBONDABLE REACTIVE HOT MELT ADHESIVES | HENKEL AG & CO. KGAA (DE) | 2016-09-01 | — | — | WO | disclosed |
| US-20160118637-A1 | POWER STORAGE DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD (JP) | 2016-04-28 | — | — | US | disclosed |
| US-20150086860-A1 | POWER STORAGE DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (JP) | 2015-03-26 | — | — | US | disclosed |
| US-20140374032-A1 | ELECTRICALLY DIVISIBLE POLYAMIDE ADHESIVE | FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (DE) | 2014-12-25 | — | — | US | disclosed |
| US-20130288112-A1 | CYCLIC QUATERNARY AMMONIUM SALT, NONAQUEOUS SOLVENT, NONAQUEOUS ELECTROLYTE, AND POWER STORAGE DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (JP) | 2013-10-31 | — | — | US | disclosed |
| WO-2004014384-A2 | CYCLIC COMPOUNDS CONTAINING ZINC BINDING GROUPS AS MATRIX METALLOPROTEINASE INHIBITORS | WARNER-LAMBERT COMPANY LLC (US) | 2004-02-19 | — | — | WO | disclosed |