⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL57015 | 0.88 | — | — | |
| SCHEMBL23069503 | 0.88 | — | — | |
| SCHEMBL5175056 | 0.84 | — | — | |
| SCHEMBL5985454 | 0.82 | LMNA (0.37) | — | |
| SCHEMBL5985551 | 0.82 | — | — | |
| SCHEMBL8813593 | 0.82 | — | — | |
| SCHEMBL16146814 | 0.82 | — | — | |
| SCHEMBL7863815 | 0.82 | — | — | |
| SCHEMBL23581530 | 0.82 | — | — | |
| SCHEMBL997873 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 176 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112789309-B | Curing agent for epoxy resin adhesive | SIKA技术股份公司 | 2024-01-09 | — | — | CN | claimed |
| WO-2023247445-A1 | SOLUTION OF POLYPHENOLS IN AMINE | SIKA TECHNOLOGY AG (CH) | 2023-12-28 | — | — | WO | claimed |
| EP-4296291-A1 | SOLUTION OF POLYPHENOLS IN AMINE | Sika Technology AG (CH) | 2023-12-27 | — | — | EP | claimed |
| EP-4284853-A1 | ADDUCT OF ALKYLATED DIAMINE AND EPOXY NOVOLAC RESIN | Sika Technology AG (CH) | 2023-12-06 | — | — | EP | claimed |
| CN-117043216-A | Adducts of alkylated diamines with novolak epoxy resins | SIKA技术股份公司 | 2023-11-10 | — | — | CN | claimed |
| US-20230331903-A1 | ADDUCT OF ALKYLATED DIAMINE AND NOVOLAK EPOXY RESIN | SIKA TECHNOLOGY AG (CH) | 2023-10-19 | — | — | US | claimed |
| US-20230312975-A1 | FLOOR PROTECTION SYSTEM WITH HIGH DYNAMIC CRACK BRIDGING | SIKA TECHNOLOGY AG (CH) | 2023-10-05 | — | — | US | claimed |
| EP-4240799-A1 | FLOOR PROTECTION SYSTEM WITH HIGH DYNAMIC CRACK BRIDGING | Sika Technology AG (CH) | 2023-09-13 | — | — | EP | claimed |
| CN-116472318-A | Ground protection system with high dynamic fracture bridging | SIKA技术股份公司 | 2023-07-21 | — | — | CN | claimed |
| EP-4036175-A1 | CORROSION PROTECTION COATING WITH HIGH THERMAL SHOCK RESISTANCE | SIKA TECHNOLOGY AG (CH) | 2022-08-03 | — | — | EP | claimed |
| US-20220033568-A1 | CURING AGENT FOR EPOXY RESIN ADHESIVES | SIKA TECHNOLOGY AG (CH) | 2022-02-03 | — | — | US | claimed |
| EP-3861048-A1 | HARDENER FOR EPOXY-RESIN ADHESIVES | Sika Technology AG (CH) | 2021-08-11 | — | — | EP | claimed |
| CN-112789309-A | Curing agent for epoxy resin adhesive | SIKA技术股份公司 | 2021-05-11 | — | — | CN | claimed |
| WO-2020070084-A1 | HARDENER FOR EPOXY-RESIN ADHESIVES | SIKA TECHNOLOGY AG (CH) | 2020-04-09 | — | — | WO | claimed |
| US-7138550-B2 | Bridged carbocyclic compounds and methods of making and using same | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2006-11-21 | — | — | US | claimed |
| US-20050037289-A1 | monomers that can be homopolymerized or copolymerized with other reactive components to make resins within sub-200 nanometer (nm) photoresist compositions | VERSUM MATERIALS US, LLC | 2005-02-17 | — | — | US | claimed |
| EP-1505050-A1 | Bridged carbocyclic compounds and methods of making and using same | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2005-02-09 | — | — | EP | claimed |
| EP-0127062-A2 | Alkylene-bis-heterocyclyl biguanides | BAYER AG (DE) | 1984-12-05 | — | — | EP | claimed |
| US-20240201592-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM | NISSAN CHEMICAL CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| US-4419518-A | VASODILATION, HYPOTENSIVE AGENTS | TOKYO TANABE CO. L.T.D. (JP) | 1983-12-06 | — | — | US | disclosed |