Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.46 |
| ▸ | PKM | P14618 | 1/20 | 0.46 |
| ▸ | HPGD | P15428 | 1/20 | 0.46 |
| ▸ | GPR84 | Q9NQS5 | 5/20 | 0.42 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9956114 | 1.00 | ALDH1A1 (0.46) | ALDH1A1PKMHPGDGPR84KCNH2 | |
| SCHEMBL535754 | 1.00 | ALDH1A1 (0.46) | ALDH1A1PKMHPGDGPR84KCNH2 | |
| SCHEMBL27699982 | 1.00 | ALDH1A1 (0.46) | ALDH1A1PKMHPGDGPR84KCNH2 | |
| SCHEMBL27680704 | 1.00 | ALDH1A1 (0.46) | ALDH1A1PKMHPGDGPR84KCNH2 | |
| SCHEMBL905200 | 1.00 | ALDH1A1 (0.46) | ALDH1A1PKMHPGDGPR84KCNH2 | |
| SCHEMBL24880067 | 1.00 | ALDH1A1 (0.46) | ALDH1A1PKMHPGDGPR84KCNH2 | |
| Hydrochloric Acid SCHEMBL28365190 | 0.98 | ALDH1A1 (0.44) | ALDH1A1PKMHPGDGPR84KCNH2 | |
| SCHEMBL9482122 | 0.98 | ALDH1A1 (0.44) | ALDH1A1PKMHPGDGPR84KCNH2 | |
| Water SCHEMBL27834068 | 0.98 | ALDH1A1 (0.44) | ALDH1A1PKMHPGDGPR84KCNH2 | |
| Water SCHEMBL28794479 | 0.98 | ALDH1A1 (0.44) | ALDH1A1PKMHPGDGPR84KCNH2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 337 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9777153-B2 | Polyalkylene carbonate resin composition having an interpenetrating crosslinked structure | SK INNOVATION CO., LTD. (KR) | 2017-10-03 | — | — | US | claimed |
| EP-2845878-B1 | POLYALKYLENE CARBONATE RESIN COMPOSITION HAVING AN INTERPENETRATING CROSSLINKED STRUCTURE | SK INNOVATION CO LTD (KR) | 2017-07-12 | — | — | EP | claimed |
| US-20170092984-A1 | POLYMER ELECTROLYTE WITH WELL-DEFINED CUBIC SYMMETRY AND PREPARATION METHOD THEREOF | POSTECH ACADEMY-INDUSTRY FOUNDATION (KR) | 2017-03-30 | — | — | US | claimed |
| CN-105087182-A | Circuit substrate cured with solder, a manufacturing method of circuit substrate equipped with electronic part, and cleaning agent composition for fluxing agent | KAO CORP | 2015-11-25 | — | — | CN | claimed |
| US-20150099829-A1 | Polyalkylene Carbonate Resin Composition Having an Interpenetrating Crosslinked Structure | SK INNOVATION CO, LTD. (KR) | 2015-04-09 | — | — | US | claimed |
| EP-2845878-A2 | POLYALKYLENE CARBONATE RESIN COMPOSITION HAVING AN INTERPENETRATING CROSSLINKED STRUCTURE | SK Innovation Co., Ltd. (KR) | 2015-03-11 | — | — | EP | claimed |
| US-20140264822-A1 | THERMOSETTING RESIN COMPOSITIONS WITH LOW COEFFICIENT OF THERMAL EXPANSION | HENKEL CORPORATION (US) | 2014-09-18 | — | — | US | claimed |
| US-8829694-B1 | Thermosetting resin compositions with low coefficient of thermal expansion | Henkel IP & Holding GmbH (DE) | 2014-09-09 | — | — | US | claimed |
| JP-4718070-B2 | — | — | 2011-07-06 | — | — | JP | claimed |
| WO-2008027119-A1 | EPOXY-BASED COMPOSITIONS HAVING IMPROVED IMPACT RESISTANCE | HENKEL CORPORATION (US) | 2008-03-06 | — | — | WO | claimed |
| WO-2001074798-A1 | REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT | LOCTITE CORPORATION (US) | 2001-10-11 | — | — | WO | claimed |
| JP-2001506313-A | — | — | 2001-05-15 | — | — | JP | claimed |
| EP-1090057-A1 | REWORKABLE THERMOSETTING RESIN COMPOSITIONS | LOCTITE CORPORATION (US) | 2001-04-11 | — | — | EP | claimed |
| WO-2000079582-A9 | CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT | LOCTITE CORP (US) | 2001-03-15 | — | — | WO | claimed |
| WO-2000079582-A1 | CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT | LOCTITE CORPORATION (US) | 2000-12-28 | — | — | WO | claimed |
| WO-2000056799-A1 | REWORKABLE THERMOSETTING RESIN COMPOSITIONS | LOCTITE CORPORATION (US) | 2000-09-28 | — | — | WO | claimed |
| EP-0929592-A4 | THERMOSETTING RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS | LOCTITE CORP (US) | 2000-09-13 | — | — | EP | claimed |
| EP-0929592-A1 | THERMOSETTING RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS | LOCTITE CORPORATION (US) | 1999-07-21 | — | — | EP | claimed |
| WO-1999005196-A1 | THERMOSETTING RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS | LOCTITE CORPORATION (US) | 1999-02-04 | — | — | WO | claimed |
| US-3933531-A | Method of rust-preventing for copper and copper alloy | SHIKOKU KASEI KOGYO COMPANY LIMITED (JP) | 1976-01-20 | — | — | US | claimed |