SCHEMBL836032

SCHEMBL836032

Oc1c(F)cc(C(c2ccccc2)(c2ccccc2)c2cc(F)c(O)c(F)c2)cc1F

nearest known ligand 0.43

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
KCNN4 O15554 6/20 0.41
AKR1C2 P52895 1/20 0.39
AKR1C1 Q04828 1/20 0.39
RPS6KA3 P51812 1/20 0.39
ALDH1A1 P00352 2/20 0.37
TSHR P16473 1/20 0.37
HSD17B1 P14061 1/20 0.37
HSD17B2 P37059 1/20 0.37
AKR1B1 P15121 1/20 0.36
SIRT1 Q96EB6 1/20 0.35
ESR1 P03372 2/20 0.34
ESR2 Q92731 2/20 0.34
PTPN1 P18031 1/20 0.34
CYP3A4 P08684 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23861355 0.82 ESR1 (0.39) KCNN4ALDH1A1ESR1ESR2CYP3A4
SCHEMBL833875 0.79 ESR1 (0.43) KCNN4ALDH1A1HSD17B1HSD17B2ESR1
SCHEMBL29229469 0.77 KCNN4 (0.36) KCNN4ALDH1A1TSHR
SCHEMBL4601584 0.76 PTGS1 (0.50) ALDH1A1ESR1ESR2CYP3A4
SCHEMBL29229471 0.75 KCNN4 (0.35) KCNN4ALDH1A1TSHR
SCHEMBL29229456 0.75 KCNN4 (0.35) KCNN4ALDH1A1TSHR
SCHEMBL8673233 0.74 CRHBP (0.54) AKR1C2AKR1C1RPS6KA3ALDH1A1TSHR
SCHEMBL11671062 0.74 ESR1 (0.50) ALDH1A1ESR1ESR2CYP3A4
SCHEMBL5990792 0.74 CRHBP (0.54) AKR1C2AKR1C1RPS6KA3ALDH1A1TSHR
SCHEMBL19880364 0.74 CHEK1 (0.42) KCNN4RPS6KA3ALDH1A1TSHRSIRT1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 65 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240101859-A1 RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM, AND METHOD FOR MANUFACTURING THE SAME FUJIFILM CORPORATION (JP) 2024-03-28 US disclosed
US-20240092967-A1 RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM, AND METHOD FOR MANUFACTURING THE SAME FUJIFILM CORPORATION (JP) 2024-03-21 US disclosed
EP-4339252-A1 RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM AND METHOD FOR PRODUCING SAME FUJIFILM Corporation (JP) 2024-03-20 EP disclosed
EP-4339251-A1 COATING RESIN COMPOSITION, POLYMER, POLYMER PRODUCTION METHOD, COATING FILM AND PRODUCTION METHOD THEREFOR FUJIFILM Corporation (JP) 2024-03-20 EP disclosed
CN-117242145-A Resin composition for coating, polymer, method for producing polymer, coating film, and method for producing coating film 富士胶片株式会社 2023-12-15 CN disclosed
CN-117203294-A Resin composition for coating, polymer, method for producing polymer, coating film, and method for producing coating film 富士胶片株式会社 2023-12-08 CN disclosed
WO-2022239655-A1 RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM AND METHOD FOR PRODUCING SAME 富士フイルム株式会社 2022-11-17 WO disclosed
WO-2022239656-A1 COATING RESIN COMPOSITION, POLYMER, POLYMER PRODUCTION METHOD, COATING FILM AND PRODUCTION METHOD THEREFOR 富士フイルム株式会社 2022-11-17 WO disclosed
US-20210139390-A1 PRODUCTION METHOD OF ORGANIC COMPOUND UNITIKA LTD. (JP) 2021-05-13 US disclosed
EP-3819283-A1 METHOD FOR PRODUCING ORGANIC COMPOUND Unitika Ltd. (JP) 2021-05-12 EP disclosed
US-6777464-B1 ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE HITACHI CHEMICAL COMPANY, LTD. (JP) 2004-08-17 US disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 US disclosed
EP-0884342-B1 Resin for coating formation and method for producing the same UNITIKA LTD (JP) 2003-09-24 EP disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed
US-6235842-B1 USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. HITACHI CHEMICAL COMPANY, LTD. (JP) 2001-05-22 US disclosed
EP-0979854-A1 CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-02-16 EP disclosed
EP-0943640-A1 HIGHLY HEAT-RESISTANT, HIGH-PURITY POLYARYLATE AND FILM PRODUCED FROM THE SAME UNITIKA LTD. (JP) 1999-09-22 EP disclosed
US-5902872-A POLYARYLATE COMPRISING 2,2-BIS/3-METHYL-4-HYDROXYPHENYL/PROPANE UNITS, TEREPHTHALIC ACID UNITS AND ISOPHTHALIC ACID UNITS, HAVING SPECIFIED INHERENT VISCOSITY UNITIKA, LTD. (JP) 1999-05-11 US disclosed
EP-0884342-A1 Resin for coating formation and method for producing the same UNITIKA LTD. (JP) 1998-12-16 EP disclosed