Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RORC | P51449 | 1/20 | 0.58 |
| ▸ | TYR | P14679 | 1/20 | 0.51 |
| ▸ | ESR1 | P03372 | 5/20 | 0.47 |
| ▸ | ESR2 | Q92731 | 3/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.43 |
| ▸ | KLF10 | Q13118 | 1/20 | 0.42 |
| ▸ | CNR1 | P21554 | 3/20 | 0.41 |
| ▸ | CNR2 | P34972 | 3/20 | 0.41 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.40 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.40 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.40 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.40 |
| ▸ | TSHR | P16473 | 1/20 | 0.40 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.40 |
| ▸ | PTGS1 | P23219 | 2/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.38 |
| ▸ | CHRM4 | P08173 | 1/20 | 0.38 |
| ▸ | CHRM5 | P08912 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11092638 | 0.90 | TYR (0.51) | RORCTYRESR1ESR2CYP3A4 | |
| SCHEMBL51353 | 0.88 | RORC (0.60) | RORCTYRESR1ESR2CYP3A4 | |
| SCHEMBL18635218 | 0.85 | RORC (0.57) | RORCTYRESR1ESR2CYP3A4 | |
| O-Xylene SCHEMBL27951443 | 0.84 | TYR (0.46) | RORCTYRESR1ESR2CYP3A4 | |
| SCHEMBL28336750 | 0.84 | RORC (0.49) | RORCTYRESR1ESR2CYP3A4 | |
| Bisphenol A SCHEMBL28901251 | 0.84 | ESR1 (0.50) | RORCTYRESR1ESR2CYP3A4 | |
| SCHEMBL15625191 | 0.83 | TYR (0.45) | RORCTYRESR1ESR2CYP3A4 | |
| SCHEMBL13760323 | 0.83 | TYR (0.50) | RORCTYRESR1ESR2CYP3A4 | |
| SCHEMBL1343545 | 0.83 | RORC (0.54) | RORCTYRESR1ESR2CYP3A4 | |
| SCHEMBL1344986 | 0.83 | RORC (0.54) | RORCTYRESR1ESR2CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11767452-B2 | Curable composition, especially as crystallizing rubber to substrate bonding primer | HENKEL AG & CO. KGAA (DE) | 2023-09-26 | — | — | US | disclosed |
| CN-110431177-A | Curable composition, in particular as primer for the adhesion of crystalline rubbers to substrates | HENKEL AG & CO KGAA | 2019-11-08 | — | — | CN | disclosed |
| EP-3135740-B1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | HENKEL AG & CO KGAA (DE) | 2018-10-10 | — | — | EP | disclosed |
| US-20180163101-A1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | HENKEL AG & CO. KGAA (DE) | 2018-06-14 | — | — | US | disclosed |
| EP-3135740-A1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | Henkel AG & Co. KGaA (DE) | 2017-03-01 | — | — | EP | disclosed |
| EP-1542273-B1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO LTD (JP) | 2013-09-25 | — | — | EP | disclosed |
| US-8436479-B2 | Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-05-07 | — | — | US | disclosed |
| US-8389328-B2 | Method of manufacturing electronic device and electronic device | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-03-05 | — | — | US | disclosed |
| EP-1717851-B1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO LTD (JP) | 2012-10-17 | — | — | EP | disclosed |
| US-8142605-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-03-27 | — | — | US | disclosed |
| US-20060014860-A1 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| EP-1542273-A1 | Circuit-connecting material and circuit terminal connected structure and connecting method | Hitachi Chemical Co., Ltd. (JP) | 2005-06-15 | — | — | EP | disclosed |
| US-20040222408-A1 | SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-11-11 | — | — | US | disclosed |
| US-6777464-B1 | ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-08-17 | — | — | US | disclosed |
| US-6235842-B1 | USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-05-22 | — | — | US | disclosed |
| EP-0979854-A1 | CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-16 | — | — | EP | disclosed |
| US-4623685-A | 1-PHENOXYCARBONYL-2,2,6,6-TETRAMETHYLPIPERIDYL COMPOUND | ADEKA ARGUS CHEMICAL CO., LTD. (JP) | 1986-11-18 | — | — | US | disclosed |
| US-4463112-A | STABILIZED COMPOSITIONS | PHOENIX CHEMICAL CORPORATION, A CORP. OF DE. | 1984-07-31 | — | — | US | disclosed |
| US-4371646-A | 2,6-Di-tertiary butyl phenyl phosphites and synthetic resin compositions having enhanced stability to heat and light | ADEKA ARGUS CHEMICAL CO. LTD. (JP) | 1983-02-01 | — | — | US | disclosed |
| US-4115476-A | 2,2,6,6-Tetramethyl-4-piperidyl carbonic acid esters of dihydric alcohols and phenols as stabilizers for synthetic polymers | ARGUS CHEMICAL CORPORATION (US) | 1978-09-19 | — | — | US | disclosed |