SCHEMBL8375595

SCHEMBL8375595

Cc1cc(C)c(C)c(-c2ccc(O)cc2)c1C

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SENP1 Q9P0U3 1/20 0.60
ESR1 P03372 8/20 0.46
ESR2 Q92731 6/20 0.46
GAA P10253 3/20 0.43
LMNA P02545 1/20 0.43
MAPK1 P28482 1/20 0.43
HTT P42858 1/20 0.43
USP7 Q93009 1/20 0.43
ABL1 P00519 2/20 0.42
ABCB1 P08183 2/20 0.42
BCR P11274 2/20 0.42
ACHE P22303 1/20 0.42
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
MGAM O43451 2/20 0.40
SI P14410 2/20 0.40
MGAM2 Q2M2H8 2/20 0.40
ALOX5 P09917 1/20 0.39
ALDH1A1 P00352 1/20 0.39
MAPT P10636 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16581409 0.87 SENP1 (0.52) SENP1ESR1ESR2GAAUSP7
SCHEMBL27603634 0.81 SENP1 (0.46) SENP1ESR1ESR2GAALMNA
SCHEMBL28088290 0.81 SENP1 (0.60) SENP1ESR1ESR2LMNAUSP7
SCHEMBL6705527 0.80 SENP1 (0.65) SENP1ESR1ESR2GAALMNA
SCHEMBL6705151 0.79 SENP1 (0.71) SENP1ESR1ESR2LMNAUSP7
SCHEMBL28148470 0.78 ESR1 (0.62) SENP1ESR1ESR2GAALMNA
SCHEMBL6246454 0.78 SENP1 (0.56) SENP1ESR1ESR2GAAABL1
SCHEMBL573213 0.78 SENP1 (0.77) SENP1ESR1ESR2GAALMNA
SCHEMBL29929295 0.77 SENP1 (0.61) SENP1ESR1ESR2LMNAUSP7
SCHEMBL4367504 0.77 SENP1 (0.61) SENP1ESR1ESR2LMNAUSP7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107849167-B Method for producing polymer for electronic material and polymer for electronic material obtained by the production method 丸善石油化学株式会社 2021-02-23 CN disclosed
CN-104541205-B Resist underlayer film forming composition containing novolac resin having polynuclear phenol 日产化学工业株式会社 2019-07-05 CN disclosed
EP-0659801-B1 Polyimide MITSUI CHEMICALS INC (JP) 1999-03-10 EP disclosed
US-5484880-A HEAT RESISTANT POLYMERS FOR APPLIANCES AND INJECTION MOLDED ARTICLES OR FILMS MITSUI TOATSU CHEMICALS, INC. (JP) 1996-01-16 US disclosed
EP-0659801-A1 Polyimide MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-06-28 EP disclosed