SCHEMBL8394133

SCHEMBL8394133

CCCCCCCCCCCC(=O)NCCN(CCCC)CCCC

nearest known ligand 0.72

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 2/20 0.72
FAAH O00519 5/20 0.66
CASP2 P42575 1/20 0.56
NAAA Q02083 1/20 0.53
KDM5A P29375 2/20 0.51
PHF8 Q9UPP1 2/20 0.51
KDM4C Q9H3R0 1/20 0.51
EPHX2 P34913 3/20 0.50
SELP P16109 1/20 0.50
HSP90AA1 P07900 1/20 0.50
CNR1 P21554 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8397761 1.00 DNM1 (0.72) DNM1FAAHCASP2NAAAKDM5A
SCHEMBL3853645 1.00 DNM1 (0.72) DNM1FAAHCASP2NAAAKDM5A
SCHEMBL8394200 1.00 DNM1 (0.72) DNM1FAAHCASP2NAAAKDM5A
SCHEMBL8399025 1.00 DNM1 (0.72) DNM1FAAHCASP2NAAAKDM5A
SCHEMBL24728718 0.96 DNM1 (0.72) DNM1FAAHCASP2NAAAKDM5A
SCHEMBL11440198 0.96 DNM1 (0.72) DNM1FAAHCASP2NAAAKDM5A
SCHEMBL9549424 0.96 DNM1 (0.77) DNM1FAAHCASP2NAAAEPHX2
SCHEMBL8398740 0.93 DNM1 (0.75) DNM1FAAHCASP2NAAAEPHX2
SCHEMBL116819 0.93 DNM1 (0.75) DNM1FAAHCASP2NAAAEPHX2
SCHEMBL116915 0.93 DNM1 (0.75) DNM1FAAHCASP2NAAAEPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5858472-A Method of improving the electrical conductivity of a molding article of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1999-01-12 US disclosed
EP-0675505-B1 A method of improving the electrical conductivity of shaped resin articles and an electrostatic coating process DAI ICHI KOGYO SEIYAKU CO LTD (JP) 1998-06-17 EP disclosed
EP-0764663-A2 Method of improving the electrical conductivity of a molding artcile of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1997-03-26 EP disclosed
US-5571472-A KNEADING AND MOLDING A RESIN WITH AMINOALKYLAMIDES DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 1996-11-05 US disclosed
EP-0675505-A1 A method of improving the electrical conductivity of shaped resin articles and an electrostatic coating process DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 1995-10-04 EP disclosed