SCHEMBL8394202

SCHEMBL8394202

CCCCCCCCCCCCC(CCN)C(=O)N(CCCC)CCCC

nearest known ligand 0.43

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CA2 P00918 2/20 0.43
GRIK1 P39086 2/20 0.42
GRIK2 Q13002 2/20 0.42
RRM1 P23921 1/20 0.41
SLC1A2 P43004 1/20 0.40
SLC1A1 P43005 1/20 0.40
CA1 P00915 3/20 0.39
CA12 O43570 2/20 0.39
CA9 Q16790 2/20 0.39
GNAI3 P08754 1/20 0.39
GNAO1 P09471 1/20 0.39
GNAI1 P63096 1/20 0.39
DPP7 Q9UHL4 1/20 0.38
GPR84 Q9NQS5 3/20 0.38
SPHK1 Q9NYA1 1/20 0.38
FFAR1 O14842 1/20 0.38
CPB2 Q96IY4 1/20 0.37
MAPT P10636 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8394140 1.00 CA2 (0.43) CA2GRIK1GRIK2RRM1SLC1A2
SCHEMBL8398250 1.00 CA2 (0.43) CA2GRIK1GRIK2RRM1SLC1A2
SCHEMBL8399033 1.00 CA2 (0.43) CA2GRIK1GRIK2RRM1SLC1A2
SCHEMBL8397769 1.00 CA2 (0.43) CA2GRIK1GRIK2RRM1SLC1A2
SCHEMBL8398680 0.93 CA2 (0.43) CA2GRIK1GRIK2SLC1A2SLC1A1
SCHEMBL8398001 0.93 CA2 (0.43) CA2GRIK1GRIK2SLC1A2SLC1A1
SCHEMBL8398708 0.93 CA2 (0.43) CA2GRIK1GRIK2SLC1A2SLC1A1
SCHEMBL8398743 0.93 CA2 (0.43) CA2GRIK1GRIK2SLC1A2SLC1A1
SCHEMBL8394272 0.93 CA2 (0.43) CA2GRIK1GRIK2SLC1A2SLC1A1
SCHEMBL8394926 0.93 CA2 (0.43) CA2GRIK1GRIK2SLC1A2SLC1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5858472-A Method of improving the electrical conductivity of a molding article of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1999-01-12 US disclosed
EP-0764663-A2 Method of improving the electrical conductivity of a molding artcile of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1997-03-26 EP disclosed