SCHEMBL8396456

SCHEMBL8396456

CCCCCCCCCC(=O)NCCCN(CC)CC

nearest known ligand 0.73

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 2/20 0.73
FAAH O00519 5/20 0.64
NAAA Q02083 1/20 0.61
CASP2 P42575 1/20 0.59
GAA P10253 1/20 0.56
PAOX Q6QHF9 1/20 0.54
EPHX2 P34913 3/20 0.53
SELP P16109 1/20 0.53
CNR1 P21554 1/20 0.51
ALDH1A1 P00352 1/20 0.51
HPGD P15428 1/20 0.51
TRPV1 Q8NER1 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL76256 1.00 DNM1 (0.73) DNM1FAAHNAAACASP2GAA
SCHEMBL76220 1.00 DNM1 (0.73) DNM1FAAHNAAACASP2GAA
SCHEMBL785831 1.00 DNM1 (0.73) DNM1FAAHNAAACASP2GAA
SCHEMBL74739 1.00 DNM1 (0.73) DNM1FAAHNAAACASP2GAA
SCHEMBL117354 1.00 DNM1 (0.73) DNM1FAAHNAAACASP2GAA
SCHEMBL75692 1.00 DNM1 (0.73) DNM1FAAHNAAACASP2GAA
SCHEMBL8394943 1.00 DNM1 (0.73) DNM1FAAHNAAACASP2GAA
Hydrochloric Acid SCHEMBL9542376 0.98 DNM1 (0.71) DNM1FAAHNAAACASP2GAA
Hydrochloric Acid SCHEMBL17394704 0.98 DNM1 (0.71) DNM1FAAHNAAACASP2GAA
SCHEMBL8398351 0.98 DNM1 (0.70) DNM1FAAHNAAACASP2GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5858472-A Method of improving the electrical conductivity of a molding article of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1999-01-12 US disclosed
EP-0764663-A2 Method of improving the electrical conductivity of a molding artcile of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1997-03-26 EP disclosed