Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 2/20 | 0.75 |
| ▸ | FAAH | O00519 | 5/20 | 0.66 |
| ▸ | NAAA | Q02083 | 1/20 | 0.62 |
| ▸ | CASP2 | P42575 | 1/20 | 0.61 |
| ▸ | EPHX2 | P34913 | 3/20 | 0.54 |
| ▸ | SELP | P16109 | 1/20 | 0.54 |
| ▸ | CNR1 | P21554 | 2/20 | 0.53 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.53 |
| ▸ | HPGD | P15428 | 2/20 | 0.53 |
| ▸ | TRPV1 | Q8NER1 | 1/20 | 0.53 |
| ▸ | MEN1 | O00255 | 1/20 | 0.53 |
| ▸ | MAPT | P10636 | 1/20 | 0.53 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.53 |
| ▸ | BLM | P54132 | 1/20 | 0.53 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.53 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.53 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL116915 | 1.00 | DNM1 (0.75) | DNM1FAAHNAAACASP2EPHX2 | |
| SCHEMBL8398740 | 1.00 | DNM1 (0.75) | DNM1FAAHNAAACASP2EPHX2 | |
| SCHEMBL117935 | 1.00 | DNM1 (0.75) | DNM1FAAHNAAACASP2EPHX2 | |
| SCHEMBL116819 | 1.00 | DNM1 (0.75) | DNM1FAAHNAAACASP2EPHX2 | |
| SCHEMBL3288198 | 1.00 | DNM1 (0.75) | DNM1FAAHNAAACASP2EPHX2 | |
| SCHEMBL117059 | 1.00 | DNM1 (0.75) | DNM1FAAHNAAACASP2EPHX2 | |
| SCHEMBL9549484 | 0.98 | DNM1 (0.77) | DNM1FAAHNAAACASP2EPHX2 | |
| SCHEMBL9549210 | 0.98 | DNM1 (0.77) | DNM1FAAHNAAACASP2EPHX2 | |
| SCHEMBL28138496 | 0.96 | DNM1 (0.75) | DNM1FAAHNAAACASP2EPHX2 | |
| SCHEMBL12515852 | 0.96 | DNM1 (0.75) | DNM1FAAHNAAACASP2EPHX2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5858472-A | Method of improving the electrical conductivity of a molding article of resin, method of coating a molding article of resin, and coating composition | NIPPON PAINT CO., LTD. (JP) | 1999-01-12 | — | — | US | disclosed |
| EP-0675505-B1 | A method of improving the electrical conductivity of shaped resin articles and an electrostatic coating process | DAI ICHI KOGYO SEIYAKU CO LTD (JP) | 1998-06-17 | — | — | EP | disclosed |
| EP-0764663-A2 | Method of improving the electrical conductivity of a molding artcile of resin, method of coating a molding article of resin, and coating composition | NIPPON PAINT CO., LTD. (JP) | 1997-03-26 | — | — | EP | disclosed |
| US-5571472-A | KNEADING AND MOLDING A RESIN WITH AMINOALKYLAMIDES | DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) | 1996-11-05 | — | — | US | disclosed |
| EP-0675505-A1 | A method of improving the electrical conductivity of shaped resin articles and an electrostatic coating process | DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) | 1995-10-04 | — | — | EP | disclosed |