SCHEMBL8397997

SCHEMBL8397997

CCCCCCCC(=O)NCCC.CCCCNCCCC

nearest known ligand 0.65

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
FAAH O00519 6/20 0.65
DNM1 Q05193 2/20 0.61
CASP2 P42575 1/20 0.60
NAAA Q02083 1/20 0.56
CNR1 P21554 3/20 0.56
HSP90AA1 P07900 1/20 0.53
MEN1 O00255 1/20 0.53
MAPK1 P28482 1/20 0.53
KMT2A Q03164 1/20 0.53
EPHX2 P34913 2/20 0.53
SELP P16109 1/20 0.53
EPHX1 P07099 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8398741 1.00 FAAH (0.65) FAAHDNM1CASP2NAAACNR1
Hexadecanoic Acid Propylamide SCHEMBL8394270 1.00 FAAH (0.65) FAAHDNM1CASP2NAAACNR1
SCHEMBL8398678 1.00 FAAH (0.65) FAAHDNM1CASP2NAAACNR1
SCHEMBL8394921 1.00 FAAH (0.65) FAAHDNM1CASP2NAAACNR1
SCHEMBL8398706 1.00 FAAH (0.65) FAAHDNM1CASP2NAAACNR1
SCHEMBL25394345 0.92 FAAH (0.68) FAAHDNM1CASP2NAAACNR1
SCHEMBL117788 0.92 FAAH (0.68) FAAHDNM1CASP2NAAACNR1
SCHEMBL118565 0.92 FAAH (0.68) FAAHDNM1CASP2NAAACNR1
SCHEMBL25395102 0.92 FAAH (0.68) FAAHDNM1CASP2NAAACNR1
SCHEMBL9097339 0.92 FAAH (0.74) FAAHDNM1CASP2NAAACNR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5858472-A Method of improving the electrical conductivity of a molding article of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1999-01-12 US disclosed
EP-0764663-A2 Method of improving the electrical conductivity of a molding artcile of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1997-03-26 EP disclosed