SCHEMBL8398002

SCHEMBL8398002

CCCCCCCCCCCCCCCCC(CCN)C(=O)N(CC)CC

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 2/20 0.44
GRIK1 P39086 2/20 0.44
GRIK2 Q13002 2/20 0.44
RRM1 P23921 1/20 0.41
SLC1A2 P43004 1/20 0.41
SLC1A1 P43005 1/20 0.41
GNAI3 P08754 1/20 0.40
GNAO1 P09471 1/20 0.40
GNAI1 P63096 1/20 0.40
DPP7 Q9UHL4 1/20 0.39
GPR84 Q9NQS5 5/20 0.39
CA1 P00915 1/20 0.39
SPHK1 Q9NYA1 1/20 0.39
FFAR1 O14842 1/20 0.39
CPB2 Q96IY4 1/20 0.38
MAPT P10636 1/20 0.38
LCK P06239 1/20 0.38
PPARD Q03181 1/20 0.38
ZDHHC20 Q5W0Z9 1/20 0.38
ZDHHC2 Q9UIJ5 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8398739 1.00 CA2 (0.44) CA2GRIK1GRIK2RRM1SLC1A2
SCHEMBL8398322 1.00 CA2 (0.44) CA2GRIK1GRIK2RRM1SLC1A2
SCHEMBL8398927 1.00 CA2 (0.44) CA2GRIK1GRIK2RRM1SLC1A2
SCHEMBL8397773 1.00 CA2 (0.44) CA2GRIK1GRIK2RRM1SLC1A2
SCHEMBL8396450 1.00 CA2 (0.44) CA2GRIK1GRIK2RRM1SLC1A2
SCHEMBL8394950 0.93 CA2 (0.44) CA2GRIK1GRIK2SLC1A2SLC1A1
SCHEMBL8394136 0.93 CA2 (0.44) CA2GRIK1GRIK2SLC1A2SLC1A1
SCHEMBL8398784 0.93 CA2 (0.44) CA2GRIK1GRIK2SLC1A2SLC1A1
SCHEMBL8395005 0.93 CA2 (0.44) CA2GRIK1GRIK2SLC1A2SLC1A1
SCHEMBL8396461 0.93 CA2 (0.44) CA2GRIK1GRIK2SLC1A2SLC1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5858472-A Method of improving the electrical conductivity of a molding article of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1999-01-12 US disclosed
EP-0764663-A2 Method of improving the electrical conductivity of a molding artcile of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1997-03-26 EP disclosed