SCHEMBL8400754

SCHEMBL8400754

CCCC=CC(C)=O.Cl[Pd]Cl

nearest known ligand 0.42

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TAS1R3 Q7RTX0 1/20 0.41
TAS1R1 Q7RTX1 1/20 0.41
PTPN1 P18031 3/20 0.37
PPARA Q07869 3/20 0.33
PPARG P37231 3/20 0.32
ALDH1A1 P00352 1/20 0.31
FASN P49327 1/20 0.31
FAAH O00519 2/20 0.30
CNR1 P21554 2/20 0.30
CNR2 P34972 2/20 0.30
PTPN2 P17706 1/20 0.30
PTPN11 Q06124 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL872905 0.91
SCHEMBL380479 0.91
SCHEMBL380478 0.91
SCHEMBL28009889 0.91 TAS1R3 (0.47) TAS1R3TAS1R1PTPN1PPARAPPARG
SCHEMBL10690892 0.88
SCHEMBL10366501 0.86 PPARA (0.44) TAS1R3TAS1R1PTPN1PPARAFAAH
SCHEMBL10366503 0.86 PPARA (0.44) TAS1R3TAS1R1PTPN1PPARAFAAH
Hydrochloric Acid SCHEMBL8925660 0.86 TAS1R3 (0.44) TAS1R3TAS1R1PTPN1PPARAPPARG
Hydrochloric Acid SCHEMBL8018515 0.86 TAS1R3 (0.44) TAS1R3TAS1R1PTPN1PPARAPPARG
Hydrochloric Acid SCHEMBL29469612 0.84 PPARA (0.42) TAS1R3TAS1R1PTPN1PPARAFAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4830714-A Process for the production of printed circuit boards BAYER AKTIENGESELLSCHAFT (DE) 1989-05-16 US claimed
EP-0153683-B1 PROCESS FOR MAKING CIRCUIT BOARDS BAYER AG (DE) 1989-04-12 EP claimed
US-5888372-A Process for producing metal-coated films in web form BAYER AKTIENGESELLSCHAFT (DE) 1999-03-30 US disclosed
US-5593739-A Method of patterned metallization of substrate surfaces LPKF CAD/CAM SYSTEME GMBH (DE) 1997-01-14 US disclosed
US-5436034-A Process for improving the adhesiveness of electrolessly deposited metal films BAYER AKTIENGESELLSCHAFT (DE) 1995-07-25 US disclosed
US-5296020-A Organic noble metal, fillers, organic solvent, aqueous dispersion of polyurethane BAYER AKTIENGESELLSCHAFT (DE) 1994-03-22 US disclosed
US-5238702-A Electrically conductive patterns BAYER AG 1993-08-24 US disclosed
US-5176743-A FORMULATION OF ACTIVATING SUBSTRATE SURFACES FOR THEIR ELECTROLESS METALLIZATION BAYER AKTIENGESELLSCHAFT (DE) 1993-01-05 US disclosed
US-4832989-A Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces BAYER AKTIENGESELLSCHAFT (DE) 1989-05-23 US disclosed
US-4830714-A Process for the production of printed circuit boards BAYER AKTIENGESELLSCHAFT (DE) 1989-05-16 US disclosed
US-4804475-A POLYMER FILMS ARE ACTIVATED BY ORGANOMETALLIC COMPLEXES BEFORE BEING COATED WITH METALS BAYER AKTIENGESELLSCHAFT (DE) 1989-02-14 US disclosed
US-4575467-A Process for activating substrates for electroless metallization BAYER AKTIENGESELLSCHAFT (DE) 1986-03-11 US disclosed