Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 1/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | USP2 | O75604 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bicarbonate SCHEMBL3257315 | 0.85 | USP2 (0.31) | EPHX1USP2 | |
| SCHEMBL5078571 | 0.79 | — | — | |
| Formic Acid SCHEMBL29221647 | 0.78 | — | — | |
| SCHEMBL3470594 | 0.69 | CA1 (0.41) | EPHX1 | |
| SCHEMBL620855 | 0.68 | USP2 (0.31) | USP2 | |
| SCHEMBL26092963 | 0.67 | — | — | |
| SCHEMBL22608837 | 0.64 | TP53 (0.31) | — | |
| SCHEMBL27810891 | 0.64 | EPHX1 (0.41) | EPHX1 | |
| SCHEMBL3382944 | 0.63 | EPHX1 (0.62) | EPHX1 | |
| SCHEMBL11930055 | 0.63 | EPHX1 (0.62) | EPHX1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0540027-B1 | Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups | DAICEL CHEM (JP) | 1999-06-09 | — | — | EP | disclosed |
| EP-0859021-A2 | Epoxidised compositions | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1998-08-19 | — | — | EP | disclosed |
| US-5494977-A | A CURABLE EPOXIDIZED POLYESTER, ADDITION POLYMER OR ADDITION-CONDENSATION COPOLYMER FORMED WITH AN ANHYDRIDE STARTING COMPOUND; SOFTENING TEMPERATURE; INKS, COATINGS, VARNISHES | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1996-02-27 | — | — | US | disclosed |
| EP-0540027-A2 | Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1993-05-05 | — | — | EP | disclosed |