Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Bicarbonate. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5078571 | 0.92 | — | — | |
| Formic Acid SCHEMBL29221647 | 0.89 | — | — | |
| SCHEMBL8401953 | 0.85 | EPHX1 (0.32) | USP2EPHX1 | |
| SCHEMBL8758841 | 0.75 | — | — | |
| SCHEMBL3470594 | 0.71 | CA1 (0.41) | EPHX1 | |
| SCHEMBL620855 | 0.70 | USP2 (0.31) | USP2 | |
| SCHEMBL26092963 | 0.69 | — | — | |
| SCHEMBL22608837 | 0.66 | TP53 (0.31) | — | |
| SCHEMBL16505085 | 0.65 | — | — | |
| SCHEMBL19513333 | 0.64 | SLC6A12 (0.43) | USP2EPHX1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20120326301-A1 | THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMICONDUCTOR DEVICE FABRICATION METHOD, AND SEMICONDUCTOR DEVICE | SEKISUI CHEMICAL CO., LTD. (JP) | 2012-12-27 | — | — | US | disclosed |
| US-20120267803-A1 | ADHESIVE FOR SEMICONDUCTOR BONDING, ADHESIVE FILM FOR SEMICONDUCTOR BONDING, METHOD FOR MOUNTING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE | SEKISUI CHEMICAL CO., LTD (JP) | 2012-10-25 | — | — | US | disclosed |
| US-20100022745-A1 | ONE COMPONENT RESIN COMPOSITION CURABLE WITH COMBINATION OF LIGHT AND HEAT AND USE OF THE SAME | MITSUI CHEMICALS, INC. (JP) | 2010-01-28 | — | — | US | disclosed |
| US-7645514-B2 | Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body | SEKISUI CHEMICAL CO., LTD. (JP) | 2010-01-12 | — | — | US | disclosed |
| US-7566377-B2 | Liquid crystal sealing agent composition and manufacturing method of liquid crystal display panel using the same | MITSUI CHEMICALS, INC. (JP) | 2009-07-28 | — | — | US | disclosed |
| US-20070096056-A1 | One component resin composition curable with combination of light and heat and use of the same | MITSUI CHEMICALS, INC. (JP) | 2007-05-03 | — | — | US | disclosed |
| US-20060154078-A1 | Curable high-molecular weight epoxy resin based on multicylcic monomer, dicylopentadiene dioxide, a glycidyl acrylate and a curing agent; no phase separation in matrix when dyed with a heavy metal; high adhesion and conduction accuracy; strength, heat/moisture resistance, flexibility; semiconductors | SEKISUI CHEMICAL CO., LTD. (JP) | 2006-07-13 | — | — | US | disclosed |
| US-20060009579-A1 | Sealing composition for liquid crystal displays and process for production of liquid crystal display panels | MITSUI CHEMICALS AND AND SHARP KABUSHIKI KAISHA (JP) | 2006-01-12 | — | — | US | disclosed |
| EP-1584657-A1 | CURING RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, ADHESIVE EPOXY RESIN SHEET, CONDUCTIVE CONNECTION PASTE, CONDUCTIVE CONNECTION SHEET, AND ELECTRONIC COMPONENT JOINED BODY | SEKISUI CHEMICAL CO., LTD. (JP) | 2005-10-12 | — | — | EP | disclosed |
| EP-0596811-B1 | Molded PVC medical device | TERUMO CORP (JP) | 1999-09-15 | — | — | EP | disclosed |
| EP-0632080-B1 | Resin composition for sealing film-made liquid crystal cells | MITSUI TOATSU CHEMICALS (JP) | 1998-04-08 | — | — | EP | disclosed |
| US-5665797-A | POLYSULFIDE MODIFIED EPOXY RESIN MIXED WITH A HYDRAZIDE, UREA, AND CURE ACCELERATOR; BONDING STRENGTH | MITSUI TOATSU CHEMICALS, INC. (JP) | 1997-09-09 | — | — | US | disclosed |
| US-5635259-A | POLYSULFIDE MODIFIED EPOXY RESIN | MITSUI TOATSU CHEMICALS, INC. (JP) | 1997-06-03 | — | — | US | disclosed |
| US-5454806-A | Blend of vinyl chloride-based resin, dialkyl malate and stabilizer; blood bag | TERUMO KABUSHIKI KAISHA (JP) | 1995-10-03 | — | — | US | disclosed |
| EP-0596811-A1 | Molded PVC medical device | TERUMO KABUSHIKI KAISHA (JP) | 1994-05-11 | — | — | EP | disclosed |
| EP-0437916-B1 | A method for producing an air-permeable adhesive tape | SEIKISUI CHEMICAL CO LTD (JP) | 1993-12-22 | — | — | EP | disclosed |
| EP-0437916-A2 | A method for producing an air-permeable adhesive tape | SEKISUI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1991-07-24 | — | — | EP | disclosed |
| US-4708924-A | CORE AND COVERING | KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) | 1987-11-24 | — | — | US | disclosed |
| US-4506043-A | Glass fiber-reinforced thermoplastic polyester composition | TEIJIN LIMITED (JP) | 1985-03-19 | — | — | US | disclosed |
| US-4276208-A | POLYETHYLENE TEREPHTHALATE, MONTAN WAX SALT | TEIJIN LIMITED (JP) | 1981-06-30 | — | — | US | disclosed |