⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3783619 | 0.75 | — | — | |
| Hydrochloric Acid SCHEMBL8987261 | 0.73 | — | — | |
| SCHEMBL3264588 | 0.72 | CYP2C19 (0.30) | — | |
| SCHEMBL27457601 | 0.64 | — | — | |
| SCHEMBL1337924 | 0.63 | GRM8 (0.38) | — | |
| SCHEMBL23501553 | 0.62 | GRM4 (0.34) | — | |
| SCHEMBL11762994 | 0.61 | AKR1C1 (0.39) | — | |
| SCHEMBL31072354 | 0.61 | FFAR3 (0.41) | — | |
| SCHEMBL168735 | 0.60 | PYGM (0.35) | — | |
| SCHEMBL11430568 | 0.60 | FFAR3 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12516139-B2 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-01-06 | — | — | US | disclosed |
| EP-4321541-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-12221523-B2 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-02-11 | — | — | US | disclosed |
| EP-4074740-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2024-11-20 | — | — | EP | disclosed |
| US-20240309127-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-09-19 | — | — | US | disclosed |
| US-20240287219-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-08-29 | — | — | US | disclosed |
| US-20240287347-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-08-29 | — | — | US | disclosed |
| US-20240279432-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-08-22 | — | — | US | disclosed |
| US-20240174809-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYERED PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2024-05-30 | — | — | US | disclosed |
| EP-4357376-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-04-24 | — | — | EP | disclosed |
| EP-4074740-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-10-19 | — | — | EP | disclosed |
| US-11466123-B2 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-10-11 | — | — | US | disclosed |
| WO-2022201621-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 日本化薬株式会社 | 2022-09-29 | — | — | WO | disclosed |
| US-20220204695-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-06-30 | — | — | US | disclosed |
| EP-3916025-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-12-01 | — | — | EP | disclosed |
| WO-2021117762-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2021-06-17 | — | — | WO | disclosed |
| EP-0659800-B1 | Polyimide precursor composition, polyimide composition and process for the production of said polyimide composition | CENTRAL GLASS CO LTD (JP) | 1999-06-23 | — | — | EP | disclosed |
| US-5840369-A | SCREEN PRINTING POLYIMIDE PRECURSOR INK ON SUBSTRATE, REMOVING SOLVENT, THERMALLY CURING INK TO FORM POLYIMIDE RELIEF PATTERN FILM | CENTRAL GLASS CO., LTD. (JP) | 1998-11-24 | — | — | US | disclosed |
| US-5686525-A | THIXOTROPIC SCREEN PRINTING INK COMPRISING A HEAT TREATED POLYAMIC ACID SOLUTION OBTAINED BY REACTION OF AROMATIC TETRACARBOXYLIC ACID, DIAMINE AND A MALEIMIDE; RELIEF IMAGES | CENTRAL GLASS COMPANY, LTD. (JP) | 1997-11-11 | — | — | US | disclosed |
| EP-0659800-A1 | Polyimide precursor composition, polyimide composition and process for the production of said polyimide composition | CENTRAL GLASS COMPANY, LIMITED (JP) | 1995-06-28 | — | — | EP | disclosed |