Fluoride

Fluoride

SCHEMBL8404886

B.F.F.F.F.N

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Fluoride SCHEMBL16318488 1.00
Fluoride SCHEMBL1350672 1.00
Fluoride SCHEMBL1158236 1.00
Hydrochloric Acid SCHEMBL17847700 0.87
Fluoride SCHEMBL28535902 0.87
Fluoride SCHEMBL7103699 0.82
Fluoride SCHEMBL10481826 0.82
Fluoride SCHEMBL1004340 0.82
Ammonia Solution, Strong SCHEMBL1728086 0.82
Fluoride SCHEMBL11685317 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4829134-A OXAZOLINE KABUSHIKI KAISHA TOSHIBA (JP) 1989-05-09 US claimed
JP-3080507-A None JP disclosed
CN-118201773-A Copper-clad laminate and circuit board using same DIC株式会社 2024-06-14 CN disclosed
CN-117222095-A Laminate, circuit board, and high-frequency circuit board DIC株式会社 2023-12-12 CN disclosed
CN-117178021-A Epoxy resin composition 株式会社KCC 2023-12-05 CN disclosed
WO-2023145439-A1 COPPER-CLAD LAMINATE PLATE AND CIRCUIT BOARD USING SAME DIC株式会社 2023-08-03 WO disclosed
CN-109153750-B Low pressure process for preparing low density polyethylene 切弗朗菲利浦化学公司 2022-04-26 CN disclosed
EP-2698401-B1 FILM USING POLYESTER COMPOSITION, SHEET-LIKE STRUCTURE, ELECTRIC INSULATION SHEET, AND SOLAR CELL BACK SHEET, AND MANUFACTURING METHODS THEREFOR TORAY INDUSTRIES (JP) 2016-10-19 EP disclosed
US-9396836-B2 Polyester composition and film using same, sheet-like structure, electric insulation sheet, and solar cell back sheet, and manufacturing method therefor TORAY INDUSTRIES, INC. (JP) 2016-07-19 US disclosed
EP-2698401-A1 POLYESTER COMPOSITION AND FILM USING SAME, SHEET-LIKE STRUCTURE, ELECTRIC INSULATION SHEET, AND SOLAR CELL BACK SHEET, AND MANUFACTURING METHODS THEREFOR Toray Industries, Inc. (JP) 2014-02-19 EP disclosed
US-20140023841-A1 POLYESTER COMPOSITION AND FILM USING SAME, SHEET-LIKE STRUCTURE, ELECTRIC INSULATION SHEET, AND SOLAR CELL BACK SHEET, AND MANUFACTURING METHOD THEREFOR TORAY INDUSTRIES, INC. (JP) 2014-01-23 US disclosed
US-5969059-A Impregnation resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1999-10-19 US disclosed
JP-H0380507-A MAGNET POWDER, MANUFACTURE THEREOF AND MAGNETIC MOLDING USING THE SAME MITSUBISHI STEEL MFG CO LTD 1991-04-05 JP disclosed
US-4829134-A OXAZOLINE KABUSHIKI KAISHA TOSHIBA (JP) 1989-05-09 US disclosed