SCHEMBL8405472

SCHEMBL8405472

C=C[Si](C)(Cl)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1493762 0.78 ALDH1A1 (0.31)
SCHEMBL28081913 0.75
SCHEMBL17063641 0.73
SCHEMBL62073 0.73
SCHEMBL28450723 0.73
SCHEMBL11570262 0.73
SCHEMBL28290734 0.73 ALDH1A1 (0.35)
SCHEMBL389623 0.71
SCHEMBL9581123 0.71
SCHEMBL11876547 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117844445-B Organic silicon liquid adhesive for LED and preparation method thereof 江苏诚睿达光电有限公司 2025-05-09 CN claimed
CN-117844445-A Organic silicon liquid adhesive for LED and preparation method thereof 江苏诚睿达光电有限公司 2024-04-09 CN claimed
CN-117844445-B Organic silicon liquid adhesive for LED and preparation method thereof 江苏诚睿达光电有限公司 2025-05-09 CN disclosed
CN-117844445-A Organic silicon liquid adhesive for LED and preparation method thereof 江苏诚睿达光电有限公司 2024-04-09 CN disclosed
CN-112126065-B Preparation method of solid silicon carbide ceramic precursor 宁波曙翔新材料股份有限公司 2023-05-02 CN disclosed
EP-0679654-B1 Process for preparation of organooxysilanes DOW CORNING (US) 1999-07-07 EP disclosed
EP-0679654-A1 Process for preparation of organooxysilanes DOW CORNING CORPORATION (US) 1995-11-02 EP disclosed
US-5374761-A Process for preparation of organooxysilanes CORNING CORPORATION (US) 1994-12-20 US disclosed