Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 4/20 | 0.62 |
| ▸ | TSHR | P16473 | 2/20 | 0.62 |
| ▸ | PIK3CA | P42336 | 1/20 | 0.62 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.50 |
| ▸ | ESR1 | P03372 | 1/20 | 0.42 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.42 |
| ▸ | CD44 | P16070 | 1/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.39 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.39 |
| ▸ | CASP7 | P55210 | 2/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.39 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.39 |
| ▸ | HPGD | P15428 | 3/20 | 0.38 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.37 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.36 |
| ▸ | CASP1 | P29466 | 1/20 | 0.36 |
| ▸ | CCNE2 | O96020 | 1/20 | 0.34 |
| ▸ | CCNE1 | P24864 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2780244 | 0.93 | CYP3A4 (0.54) | CYP3A4TSHRPIK3CAALDH1A1ESR1 | |
| SCHEMBL9800610 | 0.86 | CYP3A4 (0.64) | CYP3A4TSHRPIK3CAALDH1A1ESR1 | |
| SCHEMBL10891857 | 0.85 | CYP3A4 (0.50) | CYP3A4TSHRPIK3CAALDH1A1CD44 | |
| SCHEMBL10508078 | 0.83 | CYP3A4 (0.48) | CYP3A4TSHRPIK3CAALDH1A1ESR1 | |
| SCHEMBL5929976 | 0.83 | CYP3A4 (0.59) | CYP3A4TSHRPIK3CAALDH1A1ESR1 | |
| SCHEMBL7406902 | 0.83 | CYP3A4 (0.59) | CYP3A4TSHRPIK3CAALDH1A1ESR1 | |
| SCHEMBL25259982 | 0.81 | CYP3A4 (0.56) | CYP3A4TSHRPIK3CAALDH1A1ESR1 | |
| SCHEMBL30990676 | 0.81 | CYP3A4 (0.56) | CYP3A4TSHRPIK3CAALDH1A1ESR1 | |
| Hydrochloric Acid SCHEMBL14994099 | 0.81 | CYP3A4 (0.56) | CYP3A4TSHRPIK3CAALDH1A1ESR1 | |
| SCHEMBL30283155 | 0.81 | CYP3A4 (0.56) | CYP3A4TSHRPIK3CAALDH1A1ESR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110885443-B | Thermoplastic polyimide and preparation method thereof | 万华化学集团股份有限公司 | 2022-04-22 | — | — | CN | claimed |
| CN-109627763-B | Method for preparing polyimide molding powder by solid-phase polymerization | 万华化学集团股份有限公司 | 2022-02-18 | — | — | CN | claimed |
| CN-110885443-A | Thermoplastic polyimide and preparation method thereof | 万华化学集团股份有限公司 | 2020-03-17 | — | — | CN | claimed |
| EP-1694478-B1 | WOOD-TREATMENT METHOD COMPRISING IN SITU POLYMERISATION UNDER ELECTROMAGNETIC RADIATION | HENRI SELMER PARIS (FR) | 2008-03-05 | — | — | EP | claimed |
| JP-2007513807-A | — | — | 2007-05-31 | — | — | JP | claimed |
| EP-1694478-A1 | WOOD-TREATMENT METHOD COMPRISING IN SITU POLYMERISATION UNDER ELECTROMAGNETIC RADIATION | Henri Selmer Paris (FR) | 2006-08-30 | — | — | EP | claimed |
| WO-2005065901-A1 | WOOD-TREATMENT METHOD COMPRISING IN SITU POLYMERISATION UNDER ELECTROMAGNETIC RADIATION | HENRI SELMER PARIS (FR) | 2005-07-21 | — | — | WO | claimed |
| EP-0583958-B1 | Polyimide/aliphatic polyester copolymers | EXXON RESEARCH ENGINEERING CO (US) | 1996-10-02 | — | — | EP | claimed |
| CN-118956309-A | Underfill adhesive, and preparation method and application thereof | 韦尔通科技股份有限公司 | 2024-11-15 | — | — | CN | disclosed |
| CN-110520433-B | Phosphorus-containing phenol compound, phosphorus-containing epoxy resin, curable resin composition or epoxy resin composition, and cured product thereof | 日铁化学材料株式会社 | 2023-12-05 | — | — | CN | disclosed |
| EP-3620459-B9 | PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2023-10-04 | — | — | EP | disclosed |
| EP-3133108-B1 | FIBER-REINFORCED COMPOSITE MATERIAL | MITSUBISHI GAS CHEMICAL CO (JP) | 2023-08-02 | — | — | EP | disclosed |
| EP-3620459-B1 | PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2023-05-24 | — | — | EP | disclosed |
| EP-3620459-A1 | PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON STEEL Chemical & Material Co., Ltd. (JP) | 2020-03-11 | — | — | EP | disclosed |
| EP-0329456-B1 | Expoxy resin curing agent of a two-component type | TOA NENRYO KOGYO KK (JP) | 1994-06-01 | — | — | EP | disclosed |
| US-5091474-A | EPOXY RESIN CURING AGENT BASED ON BLENDS CONTAINING DISECONDARY AROMATIC DIAMINES | TOA NENRYO KOGYO KABUSHIKI KAISHA (JP) | 1992-02-25 | — | — | US | disclosed |
| EP-0329456-A1 | Expoxy resin curing agent of a two-component type | TOA NENRYO KOGYO KABUSHIKI KAISHA (JP) | 1989-08-23 | — | — | EP | disclosed |
| US-4784814-A | TEMPERATURE GRADIENT | CIBA-GEIGY CORPORATION (US) | 1988-11-15 | — | — | US | disclosed |
| EP-0208654-B1 | REACTION TRANSFER MOULDING PROCESS AND APPARATUS FOR THE PRODUCTION OF MOULDINGS OF THERMOSETTING MATERIALS WHICH MAY CONTAIN FILLERS AND/OR REINFORCING MATERIALS | CIBA-GEIGY AG (CH) | 1988-10-05 | — | — | EP | disclosed |
| EP-0208654-A1 | Reaction transfer moulding process and apparatus for the production of mouldings of thermosetting materials which may contain fillers and/or reinforcing materials | CIBA-GEIGY AG (CH) | 1987-01-14 | — | — | EP | disclosed |