SCHEMBL844976

SCHEMBL844976

CCCCO[Si](CCCOCC1CO1)(CCCOCC1CO1)OCCCC

nearest known ligand 0.71

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.71
ALDH1A1 P00352 5/20 0.62
TDP1 Q9NUW8 1/20 0.62
TSHR P16473 2/20 0.53
PDK1 Q15118 1/20 0.37
MAPK1 P28482 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11765255 0.97 SMN1; SMN2 (0.67) SMN1; SMN2ALDH1A1TDP1TSHRPDK1
SCHEMBL1564438 0.94 SMN1; SMN2 (0.67) SMN1; SMN2ALDH1A1TDP1TSHRPDK1
SCHEMBL611483 0.92 SMN1; SMN2 (0.62) SMN1; SMN2ALDH1A1TDP1TSHRPDK1
SCHEMBL19125483 0.89 SMN1; SMN2 (0.64) SMN1; SMN2ALDH1A1TDP1TSHRPDK1
SCHEMBL11765093 0.89 SMN1; SMN2 (0.59) SMN1; SMN2ALDH1A1TDP1TSHRPDK1
SCHEMBL9804435 0.89 SMN1; SMN2 (0.64) SMN1; SMN2ALDH1A1TDP1TSHRPDK1
SCHEMBL8925522 0.87 SMN1; SMN2 (0.71) SMN1; SMN2ALDH1A1TDP1TSHRPDK1
SCHEMBL134331 0.87 SMN1; SMN2 (0.71) SMN1; SMN2ALDH1A1TDP1TSHRPDK1
SCHEMBL845306 0.87 SMN1; SMN2 (0.71) SMN1; SMN2ALDH1A1TDP1TSHRPDK1
SCHEMBL204165 0.87 SMN1; SMN2 (0.71) SMN1; SMN2ALDH1A1TDP1TSHRPDK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7256238-B2 Modified block copolymer ASAHI KASEI CHEMICALS CORPORATION (JP) 2007-08-14 US claimed
EP-1199313-B1 Diene polymers and copolymers having an alkoxysilane group BRIDGESTONE CORP (JP) 2005-08-24 EP claimed
CN-113831676-B Antistatic resin composition, method for producing antistatic resin composition, and electronic component packaging material 旭化成株式会社 2024-11-05 CN disclosed
CN-118574883-A Rubber formulation comprising functionalized conjugated diene polymer, natural rubber and reinforcing filler 株式会社普利司通 2024-08-30 CN disclosed
CN-117545808-A A resin composition method for producing resin composition and molded article 旭化成株式会社 2024-02-09 CN disclosed
CN-117362906-A ABS resin composition, molded article, and coated molded article 旭化成株式会社 2024-01-09 CN disclosed
WO-2023008424-A1 RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, AND MOLDED BODY 旭化成株式会社 2023-02-02 WO disclosed
CN-113831676-A Antistatic resin composition, method for producing antistatic resin composition, and electronic component packaging material 旭化成株式会社 2021-12-24 CN disclosed
CN-113348207-A Block copolymer composition, molded article, method for producing molded article, and method for adjusting haze value of molded article 旭化成株式会社 2021-09-03 CN disclosed
US-10072138-B2 Rubber composition for use in tire treads THE YOKOHAMA RUBBER CO., LTD (JP) 2018-09-11 US disclosed
US-20180022913-A1 Block Copolymer Composition, Molded Material, Resin Composition, and Molded Product ASAHI KASEI KABUSHIKI KAISHA (JP) 2018-01-25 US disclosed
EP-0767179-B1 Method for producing a rubber composition BRIDGESTONE CORP (JP) 2001-06-27 EP disclosed
US-6117927-A MODIFYING TERMINAL OF A DIENE RUBBER WITH A SILANE MODIFIER HAVING A SPECIFIC FUNCTIONALITY, BRIDGESTONE CORPORATION (JP) 2000-09-12 US disclosed
EP-0661298-B1 Diene polymers and copolymers having an alkoxysilane group BRIDGESTONE CORP (JP) 1999-03-17 EP disclosed
US-5662961-A Method for forming a protective coating film on electronic parts and devices TOKYO OHKA KOGYO CO., LTD. (JP) 1997-09-02 US disclosed
EP-0773231-A2 Diene polymers and copolymers having an alkoxysilane group Bridgestone Corporation (JP) 1997-05-14 EP disclosed
EP-0767179-A2 Method for producing a rubber composition Bridgestone Corporation (JP) 1997-04-09 EP disclosed
US-5520952-A Method for forming a protective coating film on electronic parts and devices TOKYO OHKA KOGYO CO., LTD. (JP) 1996-05-28 US disclosed
US-5508333-A NONCRACKING, WEAR RESISTANCE, HYSTERESIS-FREE; TIRES BRIDGESTONE CORPORATION (JP) 1996-04-16 US disclosed
EP-0661298-A2 Diene polymers and copolymers having an alkoxysilane group BRIDGESTONE CORPORATION (JP) 1995-07-05 EP disclosed