Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMPD1 | P17405 | 3/20 | 0.38 |
| ▸ | LPAR3 | Q9UBY5 | 5/20 | 0.35 |
| ▸ | LPAR1 | Q92633 | 3/20 | 0.35 |
| ▸ | LPAR2 | Q9HBW0 | 3/20 | 0.35 |
| ▸ | MMP1 | P03956 | 1/20 | 0.34 |
| ▸ | MMP2 | P08253 | 1/20 | 0.34 |
| ▸ | MMP3 | P08254 | 1/20 | 0.34 |
| ▸ | MMP8 | P22894 | 1/20 | 0.34 |
| ▸ | S1PR2 | O95136 | 1/20 | 0.34 |
| ▸ | S1PR4 | O95977 | 1/20 | 0.34 |
| ▸ | S1PR1 | P21453 | 1/20 | 0.34 |
| ▸ | S1PR3 | Q99500 | 1/20 | 0.34 |
| ▸ | FDPS | P14324 | 2/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL127571 | 0.87 | SMPD1 (0.47) | SMPD1LPAR3LPAR1LPAR2S1PR2 | |
| SCHEMBL11525690 | 0.80 | LPAR3 (0.55) | SMPD1LPAR3LPAR1LPAR2S1PR2 | |
| SCHEMBL14841933 | 0.76 | LPAR3 (0.42) | SMPD1LPAR3LPAR1LPAR2S1PR2 | |
| SCHEMBL14841937 | 0.75 | SMPD1 (0.37) | SMPD1LPAR3LPAR1LPAR2S1PR2 | |
| SCHEMBL10826888 | 0.74 | LPAR3 (0.39) | SMPD1LPAR3LPAR1LPAR2CYP3A4 | |
| SCHEMBL28520719 | 0.74 | LPAR3 (0.39) | SMPD1LPAR3LPAR1LPAR2FDPS | |
| Trolamine SCHEMBL8570865 | 0.74 | SMPD1 (0.54) | SMPD1LPAR3LPAR1LPAR2S1PR2 | |
| Trolamine SCHEMBL30259699 | 0.74 | CYP3A4 (0.47) | LPAR3LPAR1LPAR2MMP1MMP2 | |
| SCHEMBL28520717 | 0.74 | CYP3A4 (0.38) | SMPD1LPAR3LPAR1LPAR2FDPS | |
| SCHEMBL127570 | 0.73 | CYP3A4 (0.48) | SMPD1LPAR3LPAR1LPAR2CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024135735-A1 | FOAM MOLDING COMPOSITION, FOAM-MOLDED BODY, FOAMED ELECTRIC WIRE, MANUFACTURING METHOD FOR FOAM-MOLDED BODY, MANUFACTURING METHOD FOR ELECTRIC WIRE, AND IN-VEHICLE NETWORK CABLE | ダイキン工業株式会社 | 2024-06-27 | — | — | WO | disclosed |
| US-20230242771-A1 | COMPOSITION FOR THREE-DIMENSIONAL SHAPING AND THREE-DIMENSIONAL SHAPED OBJECT | DAIKIN INDUSTRIES, LTD. (JP) | 2023-08-03 | — | — | US | disclosed |
| US-20230235182-A1 | POWDER COMPOSITION, COATING FILM, AND THREE-DIMENSIONAL SHAPED ARTICLE | DAIKIN INDUSTRIES, LTD. (JP) | 2023-07-27 | — | — | US | disclosed |
| EP-4215593-A1 | POWDER COMPOSITION, COATING FILM, AND THREE-DIMENSIONAL SHAPED ARTICLE | Daikin Industries, Ltd. (JP) | 2023-07-26 | — | — | EP | disclosed |
| EP-4215568-A1 | COMPOSITION FOR THREE-DIMENSIONAL SHAPING AND THREE-DIMENSIONAL SHAPED OBJECT | Daikin Industries, Ltd. (JP) | 2023-07-26 | — | — | EP | disclosed |
| CN-116323764-A | Composition for three-dimensional modeling and three-dimensional modeling object | 大金工业株式会社 | 2023-06-23 | — | — | CN | disclosed |
| CN-116157462-A | Composition for foam molding, foam molded body, electric wire, method for producing foam molded body, and method for producing electric wire | 大金工业株式会社 | 2023-05-23 | — | — | CN | disclosed |
| CN-116157461-A | Composition for foam molding, foam molded body, electric wire, method for producing foam molded body, and method for producing electric wire | 大金工业株式会社 | 2023-05-23 | — | — | CN | disclosed |
| US-5936048-A | Method for preparing modified resins and their applications | MITSUI CHEMICALS, INC. (JP) | 1999-08-10 | — | — | US | disclosed |
| US-5869184-A | RESIN RAW MATERIALS FOR PAINTS, ADHESIVES | MITSUI TOATSU CHEMICALS, INC. (JP) | 1999-02-09 | — | — | US | disclosed |
| US-5674947-A | HEATING RESIN WITH FUNCTIONALIZED NORBORNENE COMPOUND IN ABSENCE OF REACTION CATALYST OR INITIATOR | MITSUI TOATSU CHEMICALS, INC. (JP) | 1997-10-07 | — | — | US | disclosed |
| US-5648446-A | ADHESIVES, FIREPROOFING, HEAT RESISTANCE IN RESINS FOR MOLDING MATERIALS | MITSUI TOATSU CHEMICALS, INC. (JP) | 1997-07-15 | — | — | US | disclosed |
| US-5646240-A | THERMOSETTING MOLDING COMPOSITIONS | MITSUI TOATSU CHEMICALS, INC. (JP) | 1997-07-08 | — | — | US | disclosed |
| US-5596039-A | FLAME RETARDERS, HEAT RESISTANCE | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1997-01-21 | — | — | US | disclosed |
| US-5569726-A | USEFUL IN FLAME-RETARDING, THERMAL STABILIZATION AND COMPATIBILIZATION OF RESINS AND IN THERMOSETTING MOLDING COMPOSITIONS | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-10-29 | — | — | US | disclosed |
| US-5545702-A | THERMOSETTING RESIN COMPOSITION | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-08-13 | — | — | US | disclosed |
| US-5536795-A | ADHESIVES AND PAINTS AND FIREPROOFING THERMOSETTING RESINS | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-07-16 | — | — | US | disclosed |
| EP-0698620-A1 | Method for preparing modified resins and their applications | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1996-02-28 | — | — | EP | disclosed |
| US-5480947-A | N-METHYLOL DIGUANAMINES | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-01-02 | — | — | US | disclosed |
| EP-0612797-A2 | Modification method of resins | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1994-08-31 | — | — | EP | disclosed |